Camera module and photosensitive component thereof

A technology for photosensitive components and photosensitive components, which is applied in electrical components, image communication, color TV components, etc., can solve the problems of small light transmission, difficult demoulding, and large light transmission, so as to save material consumption and enhance structural strength. Effect

Inactive Publication Date: 2018-11-13
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Based on this, it is necessary to provide a camera module and its photosensitive component with a large light transmission and easy demoulding for the pr

Method used

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  • Camera module and photosensitive component thereof

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Embodiment Construction

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of

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Abstract

The invention relates to a camera module and a photosensitive component thereof. The photosensitive component comprises a substrate, a photosensitive element and a package body, wherein the photosensitive element is arranged on the substrate; the package body comprises an upper surface, and the package body is provided with a light transmitting hole that directly faces the photosensitive element;the light transmitting hole comprises a first light transmitting hole and a second light transmitting hole, the side wall of the first light transmitting hole extends vertically from the photosensitive element to the upper surface of the package body, the side wall of the second light transmitting hole obliquely extends from one end connected to the first light transmitting hole to the upper surface of the package body, the inner diameter of the second light transmitting hole gradually increases in the current direction, the side wall of the second light transmitting hole is a curved surface that is protruded outwards, the inner diameter of the second light transmitting hole is greater than the inner diameter of the first light transmitting hole, and a stepped surface is formed between thesecond light transmitting hole and the first light transmitting hole. According to the above photosensitive component, since the side wall of the second light transmitting hole of the package body obliquely extends and the diameter of the second light transmitting hole gradually increases in a direction away from the photosensitive element, the amount of light irradiated on the photosensitive element can be increased, and the demolding of a forming die for forming the package body can be facilitated.

Description

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Claims

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Application Information

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Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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