Wafer treatment device

A technology for processing devices and wafers, used in electrical components, bearing components, semiconductor/solid-state device manufacturing, etc., can solve problems such as base wear, and achieve the effect of improving service life, increasing stability, and avoiding relative motion

Inactive Publication Date: 2019-02-12
HUAIAN IMAGING DEVICE MFGR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a wafer processing device, which is used to solve the problem that the base is easily worn due to bearing failure in the existing

Method used

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Examples

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Example Embodiment

[0021] The specific embodiments of the wafer processing apparatus provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0022] This specific embodiment provides a wafer processing apparatus, with figure 1 It is a top-view structural schematic diagram of a wafer processing apparatus in a specific embodiment of the present invention, with the attached figure 2 It is a schematic diagram of the cross-sectional structure of the wafer processing apparatus in the specific embodiment of the present invention. image 3 It is a schematic cross-sectional view of the base in the specific embodiment of the present invention.

[0023] like figure 1 , figure 2 , image 3 As shown, the wafer processing apparatus provided by this specific embodiment includes a base 10 for carrying wafers and a bearing nested in the base 10; the base 10 is in contact with the first bearing. The surface has a first connection structure, and the sec

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer treatment device which comprises a base and a bearing, wherein the base is used for bearing wafers, and the bearing is embedded into the base in a sleeving manner. The first contacting surface between the base and the bearing is provided with a first connecting structure, the second contacting surface between the base and the bearing is provided with a second connecting structure matched with the first connecting structure, and the base is fixedly connected with the bearing by clamping the first connecting structure and the second connecting structure. The device prevents the problem that the base is irreversibly abraded by the bearing, and the service life of the base is prolonged.

Description

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Claims

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Application Information

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Owner HUAIAN IMAGING DEVICE MFGR CORP
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