Method for monitoring focal length variation of online products by utilizing SCD

一种焦距、产品的技术,应用在利用SCD监控在线产品焦距变化领域,能够解决缺乏有效监控焦距的方式、量测变异度大等问题,达到改善场域焦点与光源剂量、佳临界尺寸均匀度的效果

Inactive Publication Date: 2019-04-19
SHANGHAI HUALI INTEGRATED CIRCUIT CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above three wafer matrices lack effective monitoring methods for the focal length of online products, and the traditional CDSEM (scanning electron microscope to measure critical dimension) measurement variability is too large

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] combine figure 1 As shown, in order to demonstrate the ability of SRM, an advanced lithography step level is designed below, that is, an experiment using separate light source energy and focus to make photoresist topography with different contours, and prepare four FEM wafers (at least Four, not less than four) and five (at least five, not less than five) POR (process of Reference, process reference test piece) wafers, and measure the critical dimension by scatterometry.

[0020] The SRM parameters have been trained by the CDSEM of 4 FEM wafers, and achieved an excellent R2 (statistical coefficient of determination), which is used in statistics to measure the proportion of the variation of the dependent variable that can be explained by the independent variable. This is used to judge the accuracy of the statistical model (closer to 1 is better) and linear slope (0.98 and 1.1 respectively). see figure 2 Shown, wherein, R2=0.9814, linear slope Y=1.1072X-5.9777. figur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for monitoring focal length variation of online products by utilizing an SCD. The method comprises the steps of: automatically and finely tuning online manufacturing process parameters by utilizing an SRM measurement result; and listing an average error of a wafer focus and a light source dose, thus field domain focuses and light source doses on a wafer can be improved once a scanner receives the listed average error calibration. The method can improve the field domain focuses and the light source doses on the wafer, and improve the uniformity of critical dimensions of the wafer.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a method for monitoring focal length changes of online products by using SCD (scattering measurement critical dimension). Background technique [0002] Currently, the frequently used wafer matrices include the following three types: [0003] 1. Focus matrix (Focus matrix, FM); [0004] 2. Energy matrix (Energy matrix, EM); [0005] 3. Focus / Energy matrix (FEM). [0006] The above-mentioned three types of wafer arrays all lack effective methods for monitoring the focal length of products on the line, and the traditional CDSEM (scanning electron microscope to measure critical dimension) measurement variability is too large. [0007] Due to the continuous demand for process miniaturization of various components, lithography technology plays a key role in today's semiconductor industry; in order to produce the best line resolution, the scanner must pre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/7085
Inventor 杨然富赵珂
Owner SHANGHAI HUALI INTEGRATED CIRCUIT CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products