Electrolyte for manufacturing electrolyte copper foil and application of electrolyte

[0071] Example 1

[0072] This embodiment provides an electrolytic solution for copper foil manufacturing, the electrolytic solution comprising:

[0073] Copper ion 30g / L, sulfuric acid 30g / L, chloride ion 30ppm, inhibitor 50ppm, auxiliary agent 300ppm, pure water 250mL; among them, the inhibitor is gelatin with a coagulation value of 100 bloom, and the auxiliary agent is sodium polystyrene sulfonate with a molecular weight of 40,000 .

[0074] This embodiment provides a method for preparing copper foil using the above electrolyte, the method comprising:

[0075] (1) DC electroplating

[0076] a. Cathode pretreatment. The high-purity titanium plate is used as the cathode, and it undergoes the processes of alkali washing, pickling, and water washing in sequence.

[0077] b. DC plating. Immerse the titanium plate cathode and phosphorus copper anode (phosphorus content 0.05wt.%) in the above electrolytic solution, apply 300rpm mechanical stirring, and control the constant t

[0081] Example 2

[0082] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 250°C.

[0083] Example 3

[0084] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 300°C.