Circuits and methods for preventing bias temperature instability

a technology of bias temperature instability and circuits, applied in the field of circuits, can solve the problems of reducing the drain current increasing the threshold voltage of the cmos transistor, and negatively affecting the performance of the device in which the cmos transistor is provided,

Active Publication Date: 2020-04-02
QUALCOMM INC
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented describes how an electronic device can be controlled by converting signals into different forms for use on its power supply system (power). An invertor converts alternating current from AC sources like mains into direct currents that are then used to control other devices connected through wires. Balanced transistors help equalize voltages across multiple components while also controlling electrical flow within each component's circuits.

Problems solved by technology

The technical problem addressed in this patents relates to improving the reliability of electronic components used at different times during their lifespan without causing negative effects such as bipolar temperature instabilities caused by excessive bias temperatures.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuits and methods for preventing bias temperature instability
  • Circuits and methods for preventing bias temperature instability
  • Circuits and methods for preventing bias temperature instability

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019]As noted above, current techniques to combat BTI degradation include provision of higher supply voltages to the affected CMOS transistor (to power through the increased threshold voltage and pump up the drain current), increased timing margins (to decrease the sensitivity of the circuit to BTI degradation of the CMOS transistor), and clock toggling (to decrease the imbalance between ON periods and OFF periods experienced by the CMOS transistor). However, each of these techniques has serious drawbacks.

[0020]Accordingly, in accordance with aspects of the disclosure, a PMOS-protected inverter structure is proposed. The inverter may have an inverter pair PMOS and an inverter pair NMOS. To prevent BTI degradation of the inverter pair PMOS, a balancing transistor may be provided to balance a voltage at a source of the inverter pair PMOS. The balancing may be performed in response to receiving of a low voltage at an input node of the inverter structure, i.e., the gates of the inverter p

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

Circuits and methods for balancing Bias Temperature Instability (BTI) are disclosed. An inverter circuit comprises an inverter input node configured to receive an inverter input signal, wherein the inverter input node is coupled to gates of an inverter pair, wherein the inverter pair includes an inverter pair n-type metal-oxide-semiconductor (NMOS) transistor and an inverter pair p-type metal-oxide-semiconductor (PMOS) transistor, an inverter output node configured to provide an inverter output signal, wherein the inverter output signal is an inversion of the inverter input signal, and at least one balancing transistor configured to balance a voltage at a source of the inverter pair PMOS, a source of the inverter pair NMOS, or any combination thereof.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner QUALCOMM INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products