Apparatus and method for circuit board liquid cooling

[0016]The exploded view of FIG. 1 illustrates a liquid cooling panel 100 in accordance with the principles of the present invention. The cooling panel 100 employs a closed fluid delivery system to transfer heat from integrated circuits to a cooling liquid. The cooling panel 100 employs at least one thermally conductive plate having a liquid circulation channel stamped in it and a channel cover. In the illustrative embodiment of FIG. 1, a liquid circulation channel 102 is stamped in a liquid cooling panel comprising first 104 and second 106 plates made of thermally conductive material. In this embodiment, the second plate 106 has substantially the same outline as the thermally conductive plate 104 having a channel stamped in it. The second plate 106 operates as a channel cover for the channel 102 stamped into the plate 104. In an illustrative embodiment, the thermally conductive material of both plates 104 and 106 is 0.012″ thick copper. In this illustrative embodiment, a step 108 is fo