3 results about "Wire breakage" patented technology

The invention relates to a diamond wire cutting fluid, and a preparation method, application and a use method thereof. The diamond wire cutting fluid is prepared from, by weight, 10 to 30 parts of polyethylene glycol, 5 to 25 parts of diethylene glycol, 0.5 to 15 parts of a solubilizer, 0.5 to 15 parts of an acid-base balance agent, 0.1 to 1.5 parts of a penetrating agent, 0.1 to 1.5 parts of a dispersing agent, 0.1 to 5 parts of a corrosion inhibitor and 40 to 85 parts of water. The diamond wire cutting liquid is low in surface tension value, abrasion of a fretsaw can be reduced, the wire breaking rate is reduced, and the cutting yield of products is increased; foam generated in the cutting process can be reduced, so the problem of cylinder overflowing is solved; and the COD value is low,so microbial degradation is facilitated, and environmental pollution is reduced.

The invention discloses an IGBT module bonding wire fracture detection method based on ultrasonic reflection. The IGBT module bonding wire fracture detection method comprises the following steps of S1, building a data acquisition platform, S2, collecting ultrasonic reflection output signals of an IGBT module with the same specification as the target IGBT module under different bonding wire breakage conditions, and performing frequency domain transformation, S3, according to the collected signal data, establishing a database of the relationship between the target IGBT module bonding wire fracture number and the ultrasonic reflection output frequency domain signal, and S4, acquiring an ultrasonic reflection output signal of the target IGBT, comparing the ultrasonic reflection output signal in the established database, and judging the number of broken bonding wires of the IGBT. Ultrasonic reflection is adopted to detect the bonding wire fracture condition of the IGBT module. Compared withother existing detection methods, ultrasonic reflection is used for detecting the bonding wire breakage condition of the IGBT module, and the method has the advantages that the cost is low, the precision is high, and the detection process does not depend on the working point of the IGBT.