1,4-di(2,4-diamino phenoxy) benzenoid form high-temperature epoxy adhesive and preparation method thereof

[0045] Preparation of component A

[0046] Mix 80 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8), 20 grams of 1,3-diglycidyl meta Hydroquinone (epoxy value 0.8) and 16.1 g (0.05 moles) of 1,4-bis(2,4-diaminophenoxy)benzene were placed in a reaction kettle, heated to 90°C, and stirred for 0.5 hours , to obtain 116.1 g of a homogeneous and transparent copolymer, denoted as A1.

[0047] Mix 70 grams of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane epoxy resin (epoxy value 0.8), 30 grams of 1,3-diglycidyl meta Hydroquinone (epoxy value 0.8) and 12.9 grams (0.04 moles) of 1,4-bis(2,4-diaminophenoxy)benzene were placed in a reaction kettle, heated to 70°C, and stirred for 1 hour , Obtain 112.9 grams of homogeneous and transparent copolymer, denoted as A2.

[0048] Mix 100 grams of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin (epoxy value 0.85) with 15.1 grams (0.047 moles) of 1,4-bis(2,4- Diaminophenoxy)benzene was

[0052] Preparation of Component B

[0053] At room temperature, add 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene and 600 grams of N,N-dimethylacetamide into the reaction kettle, stir and dissolve completely, then add 208 grams (0.4 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, stirred for 0.5-1 hour to obtain 840.2 grams of homogeneous transparent solution, added 300 grams Toluene is heated to reflux, and the reflux water separation reaction is carried out. The temperature is 100 ° C, and the reaction time is 3 hours. After the reaction is completed, part of the organic solvent is separated so that the solid content is in the range of 15%-30%, which is recorded as B1.

[0054] At room temperature, 32.2 grams (0.1 moles) of 1,4-bis(2,4-diaminophenoxy)benzene and 215 grams of N,N-dimethylacetamide and 400 grams of N-methyl-2-pyrrolidone Add to the reaction kettle, stir and dissolve completely, add 104 grams (0.2 moles) of 2,2-bis[4-(3,4-dic

[0057] Preparation of 1,4-bis(2,4-diaminophenoxy)benzene type high temperature resistant epoxy adhesive

[0058] At room temperature, stir and mix components A and B according to the mass ratio of 1:1-2 to obtain a series of 1,4-bis(2,4-diaminophenoxy)benzene-type high temperature resistant epoxy adhesives , recorded as HTEA-p, p is a natural number, and the specific formula is shown in Table 1.

[0059] Table 1 Unit: Gram

[0060] Component

[0061] HTEA-6