LED lamp substrate

A technology of LED lamp substrate and graphite plate, used in electrical components, circuits, semiconductor devices, etc., can solve the problems of long manufacturing time, high manufacturing cost, poor thermal conductivity, etc., achieve high thermal conductivity and heat dissipation characteristics, reduce manufacturing costs, high The effect of thermal conductivity

Inactive Publication Date: 2015-03-18
TENGRUI PHOTOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. It must have high-temperature furnace and grinding machine equipment, and it needs 33 hours of high-temperature firing and grinding processing, so the manufacturing equipment is more expensive and the manufacturing time is longer, so the manufacturing cost is higher
[0004] 2. The heat conduction

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] See image 3 with Figure 4 , The light-emitting diode 15 (LED) and its circuit 14 are arranged on a composite material board, the composite material board is set to be composed of a graphite board 10, a boron nitride layer 12, and insulating glue layers 11, 13, the graphite board 10 The thickness of the boron nitride layer 12 is set to be 0.4mm. The thickness of the boron nitride layer 12 is set to be 0.4mm. The insulating glue layers 11 and 13 are made of nano-scale zirconia. The graphite plate 10 is The boron nitride layers 12 are bonded with an insulating glue layer 11 to be integrated, and then an insulating glue layer 13 is provided on the boron nitride layer 12, and the circuit 14 and the light emitting diode 15 are arranged on the insulating glue layer 13.

[0026] According to the above structure, the following effects and advantages can be obtained:

[0027] (1) During manufacturing, it is only necessary to coat the insulating glue layers 11 and 13 on the graphite pl

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Abstract

The invention relates to an LED lamp substrate. The objective of the invention is to reduce manufacture cost of the LED lamp substrate and realize a better heat dissipation effect. The LED lamp substrate is set to a composite material plate formed by a graphite plate, insulation cement layers and a boron nitride layer; one of the insulation cement layers is arranged on the boron nitride layer; and a line and a light-emitting diode (chip) are arranged on the insulation cement layer. According to the LED lamp substrate of the invention, the boron nitride layer is adopted to realize fast heat absorption and heat conduction effects; the graphite plate performs fast heat conduction and heat dissipation on heat; and therefore, the LED lamp substrate of the invention has the advantages of low manufacturing cost, light weight, fast heat conduction and fast heat dissipation.

Description

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Claims

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Application Information

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Owner TENGRUI PHOTOELECTRIC TECH
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