Semiconductor device having chip ID generation circuit and multi-chip package

[0018] Hereinafter, example exemplary embodiments will be described in detail with reference to the accompanying drawings. Because the exemplary embodiments may have various modified embodiments, some embodiments are illustrated in the drawings and described in the detailed description of the exemplary embodiments. However, this does not limit the inventive concept to specific exemplary embodiments, and it should be understood that the inventive concept covers all modifications, equivalents and substitutions within the idea and technical scope of the inventive concept. Like reference numbers refer to like elements throughout. In the drawings, the size and size of each structure is exaggerated, reduced, or schematically illustrated for convenience and clarity of description.

[0019] Among semiconductor devices, a high-capacity dynamic random access memory (DRAM) may be implemented in a multi-chip package including a plurality of memory dies or memory layers. For example, eac...