7 results about "Memory chip" patented technology

The invention discloses an embedded type WIFI module. The embedded type WIFI module comprises a software part and a hardware part. The hardware part comprises a microcontroller chip, a WIFI chip, a program memory chip, a filter, a first crystal oscillator, a second crystal oscillator and a power switch tube, wherein the WIFI chip is connected with the microcontroller chip through data signals, the microcontroller chip is connected with the program memory chip through serial external interfaces, the WIFI chip and the microcontroller chip are connected with the power switch tube, the WIFI chip is connected with the filter and the first crystal oscillator, and the microcontroller chip is connected with the second crystal oscillator. The software part comprises a module interface management unit, an application program module, a webpage server, a miniaturized TCP/IP protocol stack, a WIFI driving module, a bottom layer hardware interface driver and a real-time operating system module, wherein the real-time operating system module is used as a framework, and the module interface management unit, the application program module, the webpage server, the miniaturized TCP/IP protocol stack, the WIFI driving module and the bottom layer hardware interface driver are integrated on the real-time operating system module. The embedded type WIFI module has the advantage of being small in size.

The present invention relates to a single-phase electricity energy meter based on the internet, belongs to the electric power system field. The present invention provides a power supply for a singlechip and an electricity energy measuring chip through the power supply chip, a clock chip provides the clock impulse for a memory chip and the singlechip. The electricity energy measuring chip and a voltage mutual inductor collect signals from an outer power grid. The present invention reads and processes information through the singlechip, stores the information through a singlechip bus, then outputs the information to a relay and a display through a univerall pipe foot of the singlechip. Finally the singlechip is connected with the internet connected with a PC through an electromagnetic isolation transformer and a connector. When the electricity energy meter cannot work, the communication can be resumed by testing the infrared communication chip. The electricity energy meter can improve the service quality, can realize the online management, and can improve the work efficiency.

The invention discloses a cell phone data storage method and a cell phone data storage device. A memory chip is inlaid in a cell phone. The cell phone data storage method comprises the following steps: S1, receiving a boot command of a user; S2, automatically acquiring current environmental data of the cell phone; S3, encrypting the current environmental data; and S4, storing the encrypted current environmental data to the memory chip, and automatically updating the environmental data in the memory chip. The environmental data are automatically acquired, and the encrypted environmental data are stored into the memory chip inlaid in the cell phone on the condition that the cell phone can be used normally. When accidents or legal disputes happen to the user, a cell phone manufacture, as allowed by laws, deciphers key environmental data for the user so as to provide evidences and clues for the laws.

The invention provides a method for forming a multilayer composite film and a three-dimensional memory device. The method includes sequentially depositing a multilayer composite film on a three-dimensional memory chip, and obtaining a flat surface three-dimensional memory chip through subsequent annealing and CMP processes, wherein The stress coefficients of each layer of the film in the multilayer composite film are not completely the same. The existing single-layer film with a single stress coefficient is replaced by a multi-layer composite film with a combination of different stress coefficients, thereby solving the problem of increased defects, uneven thickness, and stress caused by the increase in the thickness of the single-layer single-stress coefficient cover film. There are many problems such as surface cracking caused by the increase.