High temperature resistant cyanate ester-based copper-clad laminate

A technology of copper-clad laminate and cyanate resin, which is applied in the field of high-temperature-resistant cyanate-based copper-clad laminate, can solve the problems of high brittleness of copper-clad laminates, and achieve enhanced mechanical properties, increased dielectric loss factor, and comprehensive The effect of excellent performance

Inactive Publication Date: 2019-01-15
久耀电子科技(江苏)有限公司
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AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a high-temperature-resistant cyanate-based copper-clad laminate to s

Method used

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Embodiment Construction

[0009] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the preparation process in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0010] The invention provides a technical solution: a high-temperature-resistant cyanate-based copper-clad laminate, including PPO / CE matrix resin, is to use bisphenol A-type cyanate resin (CEO1PO) and polyphenylene ether (PPO630), in a total It is produced under the treatment of mixed modification method; SA90 / CE matrix resin is produced by modified polyphenylene ether (SA90) and bisphenol A cyanate resin (CEO1PO) under the blending modification met

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Abstract

The invention discloses a high temperature resistant cyanate ester-based copper-clad laminate. PPO/CE matrix resin is prepared by blending modification of bisphenol A type cyanate ester resin (CEO1PO)and polyphenyl ether (PPO630); SA90/CE matrix resin is produced by blending modification of modified polyphenylene ether (SA90) and bisphenol A type cyanate ester resin (CEO1PO); respectively using PPO/CE and SA90/CE resin systems as a basic material and after the reinforced treatment with inorganic glass cloth, two kinds of copper-clad laminates are produced, and the copper-clad laminate made ofSA90/CE resin system is obtained. When the comprehensive performance is optimal, the mass ratio of the resins is 2:2.2. With the increasing of the TAIC content of the cross-linking agent, mechanicalproperties of the copper-clad laminate are enhanced, dielectric constant and dielectric dissipation factor are both increased, water absorption rate changes little, and floating solder resistance is obviously enhanced. When the mass fraction of the cross-linking agent added is about 3%, the comprehensive performance of the copper-clad laminate is excellent.

Description

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Claims

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Application Information

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Owner 久耀电子科技(江苏)有限公司
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