Preparation method and preparation equipment for flexible device

A flexible device and device technology, applied in the field of preparation of flexible devices, can solve the problems of reducing production operation cost and high damage rate of carrying substrates, and achieve the effects of reducing production cost, improving separation effect and protecting integrity

Pending Publication Date: 2020-07-03
FUJIAN HUAJIACAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, it is necessary to provide a preparation method and preparation equipment for flexible devices, which can solve the problem of high damage r

Method used

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Example Embodiment

[0035] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0036] see Figure 1 to Figure 5 , in this embodiment, a method for preparing a flexible device is provided, comprising the steps of: coating a sacrificial layer 3 on a carrier substrate 1 by spin coating, doctor blade coating or casting process, and the thickness of the sacrificial layer 3 is 10 μm to 100 μm. And the sacrificial layer 3 is placed in a cavity at a temperature of 50° C. to 80° C. for baking, drying, and curing. Coat the flexible substrate solution on the sacrificial layer 3, the flexible substrate solution can be PI solution, etc., and adopt the method of step-by-step heating and drying to form a flexible substrate layer 4 with a thickness of 5 μm to 20 μm, and then manufacture OLED devices. The flexible device is place

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PUM

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Abstract

The invention provides a preparation method and preparation equipment for a flexible device, and the method comprises the steps: coating a sacrificial layer on a bearing substrate, and carrying out the baking, drying and curing; coating the sacrificial layer with a flexible substrate solution, and heating and drying the sacrificial layer to form a flexible substrate layer; manufacturing an OLED device on the flexible substrate layer; placing a flexible device in a hydrolysis tank, and hydrolyzing the sacrificial layer to separate the bearing substrate from the flexible substrate layer with theOLED device; drying the bottom of the flexible substrate layer to obtain the flexible device with the OLED device and the flexible substrate layer. Laser is used for cutting the flexible device. According to the technical scheme, the sacrificial layer is prepared by means of the adhesion and water solubility characteristics of the polymer material, and the flexible device is obtained by dissolving and separating the flexible device and the bearing substrate. The integrity of the flexible device is protected, and adverse effects caused by cutting and stripping are avoided.

Description

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Claims

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Application Information

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Owner FUJIAN HUAJIACAI CO LTD
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