Electrostatic protection structure and electrostatic protection circuit

An electrostatic protection and resistance technology, applied in circuits, electrical components, electric solid devices, etc., can solve problems such as poor electrostatic protection ability, and achieve the effect of improving conduction uniformity

Active Publication Date: 2020-07-10
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology describes an electrical device that has two components - a buriedoxy layer made up of silicon dioxide (SiO2) and resistors placed inside it. These elements have different types of conductive paths for better performance at certain voltages. By adding this element into another part called the buried oxygen layer or reservoir, we can improve its overall functioning even more effectively.

Problems solved by technology

This technical problem addressed by this patents relates to improving the electrical properties of semiconductors during manufacturing processes like etching. Specifically, these improvements aim to reduce damage caused by electricity from various sources including electrification chambers, substrate layers, and thin films formed over them while maintain their functionality.

Method used

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  • Electrostatic protection structure and electrostatic protection circuit
  • Electrostatic protection structure and electrostatic protection circuit
  • Electrostatic protection structure and electrostatic protection circuit

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Embodiment Construction

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiment is only an embodiment of the embodiments of the present application, but not all of the embodiments. Based on the embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] It should be noted that the "embodiment" referred to here refers to a specific feature, structure or characteristic that may be included in at least one implementation manner of the embodiment of the present application. In the description of the embodiments of the present application, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only, and

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Abstract

The invention provides an electrostatic protection structure, and the structure comprises a buried oxide layer, a resistor, a field effect transistor and a diode assembly, wherein the field effect transistor and the diode assembly are arranged on the buried oxide layer; the field effect transistor comprises a first injection region, a first well region, a second injection region, a second well region and a third injection region, whereinthe first well region and the second well region are low-voltage well regions; insulating layers are arranged on the faces, away from the buried oxide layer, of the first well region and the second well region, the insulating layer of the first well region and the insulating layer of the second well region are in bridge connection to lead out a gate terminal, and the gate terminal is a high-voltage gate terminal. The first injection region and the third injection region are bridged to lead out a source end, and the source end is grounded; a drain terminal is led out of the second injection region; the first end of the resistor is connected with the gate end, the second end of the resistor is grounded, and the diode assembly is connected with the field effect transistor. Based on the embodiment of the invention, the gateelectrode of the field effect transistor is connected with the resistor in series and forms a capacitive coupling effect with the parasitic coupling capacitor between the drain electrode and the gateelectrode, so the conduction uniformity of the field effect transistor is improved.

Description

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Claims

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Application Information

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Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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