Conductive nano foam and processing technology thereof

A conductive nano and conductive foam technology, which is applied to the conductive layer on the insulating carrier, the equipment and circuits used to manufacture the conductive/semi-conductive layer, etc., can solve the problem that the conductive foam does not have the heat dissipation function and the conductive performance of the conductive foam. Poor, ultra-thin products cannot be done, etc., to achieve the effect of good heat dissipation, barrier-free production and processing, and good elasticity

Pending Publication Date: 2020-09-18
深圳市时利达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The current method for producing electrically conducting foams involves adding metal powders or other materials into an organic solvent solution containing polyvinyl alcohol (PVA) resins dissolved therein. This mixture forms tiny particles called nanoconductors which help create strong connections between each particle when they are mixed together. These methods allow for high flexibility and low cost manufacturing while still maintaining excellent conduction properties.

Problems solved by technology

The technical problem addressed for this patented technology relates how current conducting foams are lacked with good flexibility or ability to absorb large amounts of energy during impact without losing their effectiveness due to insufficient strength when compressed. This can lead to reduced performance and durability issues associated with smaller conductors that require better thermal management than larger ones.

Method used

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  • Conductive nano foam and processing technology thereof
  • Conductive nano foam and processing technology thereof
  • Conductive nano foam and processing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1: as figure 1 As shown, a conductive nano-foam comprises a polyurethane foam layer 1, the surface of the polyurethane foam layer 1 is provided with an inner nickel-plated layer 2, and the surface of the inner nickel-plated layer 2 is provided with a copper-plated layer 3, and the copper-plated layer 3 The surface is provided with an outer nickel plating layer 4. The thickness of the conductive foam is 0.1-2.0mm.

[0027] Its processing technology includes the following steps:

[0028] (1) Foam finishing: Polyurethane foam is processed and formed by punching equipment, and the hole diameter of the hole is 0.1-3.0mm;

[0029] (2) Nano-nickel plating: Nano-water nickel-plating technology, the surface of the foam is subjected to nano-nickel plating in all directions, so that the surface of the foam has high conductivity in all directions vertically;

[0030] (3) Nano-copper plating: nano-water copper plating technology, on the basis of nickel plating on the foam

Embodiment 2

[0033] Embodiment 2: as figure 2 As shown, a conductive nano-foam comprises a polyurethane foam layer 1, the surface of the polyurethane foam layer 1 is provided with an inner nickel-plated layer 2, and the surface of the inner nickel-plated layer 2 is provided with a copper-plated layer 3, and the copper-plated layer 3. A gold-plated layer 5 is provided on the surface. The thickness of the conductive foam is 0.1-2.0mm.

[0034] Its processing technology includes the following steps:

[0035] (1) Foam finishing: Polyurethane foam is processed and formed by punching equipment, and the hole diameter of the hole is 0.1-3.0mm;

[0036] (2) Nano-nickel plating: Nano-water nickel-plating technology, the surface of the foam is subjected to nano-nickel plating in all directions, so that the surface of the foam has high conductivity in all directions vertically;

[0037] (3) Nano-copper plating: nano-water copper plating technology, on the basis of nickel plating on the foam surface,

Embodiment 3

[0040] Embodiment 3: as image 3 As shown, a conductive nano-foam comprises a polyurethane foam layer 1, the surface of the polyurethane foam layer 1 is provided with an inner nickel-plated layer 2, and the surface of the inner nickel-plated layer 2 is provided with a copper-plated layer 3, and the copper-plated layer 3. A silver-plated layer 6 is provided on the surface. The thickness of the conductive foam is 0.1-2.0mm.

[0041] Its processing technology includes the following steps:

[0042] (1) Foam finishing: Polyurethane foam is processed and formed by punching equipment, and the hole diameter of the hole is 0.1-3.0mm;

[0043] (2) Nano-nickel plating: Nano-water nickel-plating technology, the surface of the foam is subjected to nano-nickel plating in all directions, so that the surface of the foam has high conductivity in all directions vertically;

[0044] (3) Nano-copper plating: nano-water copper plating technology, on the basis of nickel plating on the foam surface,

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Abstract

The invention discloses conductive nano foam and a processing technology thereof. The conductive nano foam comprises a polyurethane foam layer, an inner nickel-plated layer is arranged on the surfaceof the polyurethane foam layer, a copper-plated layer is arranged on the surface of the inner nickel-plated layer, and an outer nickel-plated layer/gold-plated layer/silver-plated layer is arranged onthe surface of the copper-plated layer. The processing technology comprises the following steps: (1) foam finish machining; (2) nano nickel plating; (3) nano copper plating; (4) nano nickel/gold/silver plating; and (5) full inspecting of the appearance of the product and packaging. Compared with the prior art, the conductive foam has the advantages that the conductive foam is good in elasticity,the conductive performance of the small-size conductive foam is good, production and processing of ultrathin products are barrier-free, and the heat dissipation effect is good.

Description

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Claims

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Application Information

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Owner 深圳市时利达科技有限公司
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