High-performance copper alloy and preparation method thereof

A copper alloy, high-performance technology, applied in metal material coating process, fusion spraying, coating, etc., can solve the problems of poor high temperature resistance, poor strength, etc., achieve good electrical conductivity, improve high temperature resistance, improve resistance Effect of High Temperature Properties and Strength

Pending Publication Date: 2020-12-29
安博科(佛山)金属有限公司
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to provide a high-performance copper alloy and its preparation method, which has the advantages of good

Method used

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  • High-performance copper alloy and preparation method thereof
  • High-performance copper alloy and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] A method for preparing a high-performance copper alloy, comprising the steps of:

[0028] step one:

[0029] The nickel-copper alloy layer 9 is deposited on the surface of the brass alloy layer 8 by the HVOF method, and then the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 is polished, degreased by electrocleaning, activated and post-treated.

[0030] Step two:

[0031] Using the HVOF method to deposit the intermediate layer 2 on the surface of the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 obtained in step 1, and depositing the tungsten alloy layer 3 on the surface of the intermediate layer 2 by using the HVOF method.

[0032] Step three:

[0033] A ceramic material layer 4 is deposited on the surface of the tungsten alloy layer 3 obtained in step 2 by using the HVOF method, and then a white graphene layer 5 is deposited on the surface of the ceramic material layer 4 by a brushing method.

[

Example Embodiment

[0036] Embodiment one:

[0037] Utilize the HVOF method to deposit a nickel-copper alloy layer 9 on the surface of the brass alloy layer 8, and then the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 is polished, electrically degreased, activated, and post-treated. The HVOF method deposits an intermediate layer 2 on the surface of the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 obtained in step one, and utilizes the HVOF method to deposit a tungsten alloy layer 3 on the surface of the intermediate layer 2, and utilizes the HVOF method to deposit a tungsten alloy layer 3 on the surface of the intermediate layer 2, and utilizes the HVOF method in step two. The surface of the obtained tungsten alloy layer 3 is deposited with a ceramic material layer 4, and then the white graphene layer 5 is deposited on the surface of the ceramic material layer 4 by a brushing method, and the carbon foam is deposited on the su

Example Embodiment

[0038] Embodiment two:

[0039] In embodiment one, add following operation:

[0040] Using the HVOF method to deposit the intermediate layer 2 on the surface of the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 obtained in step 1, and depositing the tungsten alloy layer 3 on the surface of the intermediate layer 2 by using the HVOF method.

[0041]Utilize the HVOF method to deposit a nickel-copper alloy layer 9 on the surface of the brass alloy layer 8, and then the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 is polished, electrically degreased, activated, and post-treated. The HVOF method deposits an intermediate layer 2 on the surface of the base layer 1 formed by the brass alloy layer 8 and the nickel-copper alloy layer 9 obtained in step one, and utilizes the HVOF method to deposit a tungsten alloy layer 3 on the surface of the intermediate layer 2, and utilizes the HVOF method to deposit a tungsten a

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Abstract

The invention discloses a high-performance copper alloy and a preparation method thereof. The high-performance copper alloy comprises a base layer, a middle layer is arranged on the surface of the base layer, a tungsten alloy layer is arranged on the surface of the middle layer, a ceramic material layer is arranged on the surface of the tungsten alloy layer, and a white graphene layer is arrangedon the surface of the ceramic material layer. According to the high-performance copper alloy, the middle layer is deposited on the base layer, and an Al-Mg alloy can improve the strength and corrosionresistance of the whole copper alloy; the tungsten alloy layer is deposited, a melting point of the tungsten alloy is high, the high-temperature strength, creep resistance, heat conductivity and electric conductivity are good, and the high-temperature resistance and other properties of the whole copper alloy can be improved; the ceramic material layer is deposited, the ceramic material is good inhigh-temperature resistance, and the high-temperature resistance of the whole copper alloy can be improved; and the white graphene layer is painted, the white graphene can toughen the copper alloy, and the high-temperature resistance, corrosion resistance, insulation, heat conduction, high barrier property and the like of the whole copper alloy are improved.

Description

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Claims

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Application Information

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Owner 安博科(佛山)金属有限公司
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