Heat exchange substrate assembly, heat exchange module, controller and air conditioner

A substrate and component technology that is applied in the fields of heat exchange substrate components, heat exchange modules, controllers, and air conditioners. It can solve problems such as built-in protection actions, small air-cooled heat dissipation capacity, and rise in module surface temperature to prevent shutdown protection. Effect

Pending Publication Date: 2021-01-05
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for efficient use of energy during different stages of operation while maintaining proper performance levels on both types of equipment. It uses a system with a thermally-responsive material that can be controlled remotely or automatically based upon factors like ambient temperatures. By doing this, it ensures better efficiency over all possible conditions.

Problems solved by technology

This patented technical solution describes different ways how to improve thermal management systems (TPS) inside electronic devices like servers. These improvements aimed at improving their ability to efficiently remove excessive amounts of heat generated by certain components within these machines without causing damage during normal operation.

Method used

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  • Heat exchange substrate assembly, heat exchange module, controller and air conditioner
  • Heat exchange substrate assembly, heat exchange module, controller and air conditioner
  • Heat exchange substrate assembly, heat exchange module, controller and air conditioner

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Embodiment Construction

[0028] see in conjunction Figure 1 to Figure 7 As shown, according to an embodiment of the present invention, a heat exchange substrate assembly is provided, including a substrate body 1 and a temperature sensing package 3, a cooling flow channel is constructed in the substrate body 1, and the cooling flow channel has an inlet pipe 11, There is a flow regulating device 2 inside the inlet pipe 11, the temperature sensing package 3 communicates with the flow regulating device 2 and is filled with a thermal medium, and the thermal medium can follow the temperature of the preset area detected by the temperature sensing package 3 The temperature change and / or the temperature change of the cooling medium in the inlet pipeline 11 adjusts the flow rate of the cooling medium circulating in the flow regulating device 2 , such as the thermal medium such as R134a, R32, R22, R245fa and other refrigerants. In this technical solution, a flow regulating device is provided in the inlet pipe of

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Abstract

The invention provides a heat exchange substrate assembly, a heat exchange module, a controller and an air conditioner. The heat exchange substrate assembly comprises a substrate body and a temperature sensing bulb, a cooling flow channel is constructed in the substrate body, the cooling flow channel is provided with an inlet pipeline, a flow adjusting device is arranged in the inlet pipeline, thetemperature sensing bulb is communicated with the flow adjusting device and is filled with a thermal medium, and the thermal medium can adjust the flow of the cooling medium flowing in the flow adjusting device along with the temperature change of a preset area detected by the temperature sensing bulb and/or the temperature change of the cooling medium in the inlet pipeline. According to the heatexchange substrate assembly, the heat exchange module, the controller, the air conditioner and the flow adjusting device, the flow of the cooling medium circulating in the flow adjusting device is adjusted in real time through the thermal medium, no external control component is needed, and the cooling load and the thermal load of the cooling fluid in the heat exchange substrate assembly are matched and balanced.

Description

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Claims

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Application Information

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Owner GREE ELECTRIC APPLIANCES INC
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