Niobium alloy sputtering target material and preparation method thereof

A sputtering target, niobium alloy technology, applied in sputtering coating, metal material coating process, vacuum evaporation coating, etc. Simple, small grains, improve poor effect

Active Publication Date: 2021-11-02
丰联科光电(洛阳)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology produces small tantalum nitride (TaN) sintered targets that have very low specific gravity compared to other metals like gold or silver. These targets may then be used during manufacturing processes such as liquid crystal displays (LCDs). They should meet certain standards set forth in these industries due to their high melting point temperature and chemical reactivity towards various substances commonly found on electronic devices. Additionally they must maintain its integrity even after prolonged use at elevated temperatures over time without losing effectiveness.

Problems solved by technology

The technical problem addressed by this patented solution relates to finding better ways to match or enhance the quality of metal layers during fabrication processes when making thin films that can transmit signals at very fast speeds without causing any issues such as cracks caused by stress on certain parts of the device's structure.

Method used

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Effect test

preparation example Construction

[0027] A method for preparing a niobium alloy sputtering target, in terms of parts by mass, the niobium alloy sputtering target contains 40-80 parts of niobium element and 20-60 parts of titanium element;

[0028] The preparation method of niobium alloy sputtering target mainly includes the following steps:

[0029] Step 1. In terms of parts by mass, take 40-80 parts of niobium powder, 20-60 parts of titanium powder, and 0.1-0.3 parts of activated carbon powder. The purity of niobium powder and titanium powder is not less than 99.9%, and pass through a 200-mesh sieve ; The purity of activated carbon powder is not less than 99.9%, pass through a 100-mesh sieve, put it in a V-shaped mixer under the atmosphere of protective gas, pass argon as the protective gas, and mix according to the ball-to-material ratio of 1:1~1.5 material, the mixing time is 12~48h and fully mixed to obtain mixed powder;

[0030] Step 2. Put the mixed powder obtained in Step 1 into the rubber sleeve, vibrate

Embodiment 1

[0037] A method for preparing a niobium alloy sputtering target, comprising the following steps:

[0038] Step 1: Add niobium powder and titanium powder into the V-type mixer in proportions of 60 parts and 40 parts by mass respectively, and add activated carbon powder with a total weight ratio of 0.2% of the metal powder. The purity of niobium powder and titanium powder is not less than 99.9%, and passes through a 200-mesh sieve; the purity of activated carbon powder is not less than 99.9%, and passes through a 100-mesh sieve. Argon is passed through the mixer as a protective gas, and the mixer is started and mixed for 18 hours and then shut down to obtain a mixed powder;

[0039] Step 2: Select a suitable size rubber sleeve according to the needs, put the mixed powder obtained in step 1 into the rubber sleeve, and shake it while loading. After filling the powder, seal the rubber sleeve, and then shape the rubber sleeve so that The rubber sleeve keeps the shape of a rectangular

Embodiment 2

[0045] A method for preparing a niobium alloy sputtering target, comprising the following steps:

[0046] Step 1: Add niobium powder and titanium powder into the V-type mixer in proportions of 70 parts by mass and 30 parts by mass, and add activated carbon powder with a weight ratio of 0.3% of the total metal powder. The purity of niobium powder and titanium powder is not less than 99.9%, and passes through a 200-mesh sieve; the purity of activated carbon powder is not less than 99.9%, and passes through a 100-mesh sieve. Argon is passed through the mixer as a protective gas, and the mixer is started and mixed for 18 hours and then shut down to obtain a mixed powder;

[0047]Step 2: Select a suitable size rubber sleeve according to the needs, put the mixed powder obtained in step 1 into the rubber sleeve, and shake it while loading. After filling the powder, seal the rubber sleeve, and then shape the rubber sleeve so that The rubber sleeve keeps the shape of a cuboid; put the po

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Abstract

The invention discloses a niobium alloy sputtering target material and a preparation method thereof. The niobium alloy sputtering target material comprises 40-80 parts of niobium element and 20-60 parts of titanium element. The preparation method of the niobium alloy sputtering target material comprises the following steps: fully and uniformly mixing niobium powder, titanium powder and activated carbon powder under the action of protective gas to obtain mixed powder; then filling a rubber sleeve with the mixed powder, and carrying out cold isostatic pressing to obtain a green body; then loading the green body into a sheath and carrying out vacuum degassing, and carrying out hot isostatic pressing treatment on the degassed sheath to obtain a sintered blank; heating the sintered blank under the protective atmosphere, and then carrying out hot rolling, leveling and annealing to obtain a niobium alloy plate blank; and finally, grinding the niobium alloy plate blank to obtain the niobium alloy sputtering target material. The niobium alloy sputtering target material produced by adopting the method is high in purity and fine in crystal grain, can be used for manufacturing a transition layer material matched with a copper film layer in a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) manufacturing process, has good matching with the copper film layer in the aspects of corrosion resistance, thermal stability and the like, and relieves the defects in the TFT-LCD manufacturing process.

Description

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Claims

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Application Information

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Owner 丰联科光电(洛阳)股份有限公司
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