Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor

a technology of polymer resin and composition, which is applied in the field of polymer resin composition, can solve the problems of difficult to deposit the oxide used as a blocking layer without forming a void, the manufacturing productivity may be relatively low, and the number of shots in the exposure process may be reduced, and the process time may be reduced. , the effect of improving the productivity of the semiconductor device manufacturing process

Inactive Publication Date: 2007-10-25
SAMSUNG ELECTRONICS CO LTD
View PDF4 Cites 66 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present inventors have developed a new type of material called polyimide (PI), which can help create better electrically conductive paths inside materials like plastic films used during manufacturing processes such as lithography. This results in more efficient production of electronic devices made up of these materials compared to traditional methods involving copper wires.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the efficiency and yield rate of producing electronic components while minimizing damage caused by residual particles left inside the component's surface due to insufficient removal of certain areas within the element called the bottom elecronic plateauge. Additionally, reducing costs associated with these methods can lead to higher production rates but also requires cost reduction techniques involving lithography technology.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor
  • Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor
  • Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

[0158]In Synthesis Example 1, about 501.4 g of propyleneglycol monomethylether acetate (Shiny Company, Taiwan) was added as a solvent to a 1,000 mL flask coupled to a reflux condenser and a stirrer. The solvent was stirred and a temperature of the solvent was increased up to about 80° C. A reaction temperature was kept at a temperature of about 80° C., and a mixture of about 152 g of benzyl methacrylate (Aldrich, U.S.A.), about 43.7 g of 2-hydroxyethyl acrylate (Aldrich, U.S.A.), about 22.96 g of methacrylic acid (Aldrich, U.S.A.), and about 40.5 g of dimethyl-2,2′-azobis(2-methylpropionate) (V-601, Wako Corp., Japan) was dropped into the flask for one to three hours. After all of the mixture was dropped into the flask, the reaction temperature was kept at a temperature of about 80° C. A mixture in the flask was stirred and reacted for about four to five hours, and thus a transparent copolymer was produced. Characteristics of the copolymer were measured using a gel permeation chromatog

synthesis example 2

[0159]In Synthesis Example 2, the copolymer was synthesized through substantially the same processes as those used to synthesize Synthesis Example 1, except that the mixture dropped into the flask was a mixture of about 150.9 g of benzyl methacrylate, about 43.7 g of 2-hydroxyethyl acrylate, about 24.1 g of methacrylic acid, and about 40.5 g of dimethyl-2,2′-azobis(2-methylpropionate). Characteristics of the copolymer were measured using a gel permeation chromatography. The copolymer that was produced had about 7,000 of a weight average molecular weight based on a polystyrene standard, about 2,900 of a number average molecular weight based on a polystyrene standard, and about 29.01 percent by weight of solid content measured after drying the copolymer at a temperature of about 160° C. for about one hour. Also, the copolymer that was produced had about 11 percent by weight of methacrylic acid.

synthesis example 3

[0160]In Synthesis Example 3, the copolymer was synthesized through substantially the same processes as those used to synthesize Synthesis Example 1, except that the mixture dropped into the flask was a mixture of about 149.8 g of benzyl methacrylate, about 43.7 g of 2-hydroxyethyl acrylate, about 25.1 g of methacrylic acid, about 25.15 g of alpha-methylstyrene dimer, and about 40.5 g of dimethyl-2,2′-azobis(2-methylpropionate). Characteristics of the copolymer were measured using gel permeation chromatography. The copolymer that was produced had about 7,000 of a weight average molecular weight based on a polystyrene standard, about 2,900 of a number average molecular weight based on a polystyrene standard, and about 28.67 percent by weight of a solid content measured after drying the copolymer at a temperature of about 160° C. for about one hour. Also, the copolymer that was produced had about 11.5 percent by weight of methacrylic acid.

Preparation of a Polymer Resin Composition

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Temperatureaaaaaaaaaa
Temperatureaaaaaaaaaa
Percent by massaaaaaaaaaa
Login to view more

Abstract

A polymer resin composition, a method for forming a pattern using the polymer resin composition, and a method for fabricating a capacitor using the polymer resin composition are disclosed. The polymer resin composition includes about 75 to 93 percent by weight of a copolymer prepared from benzyl methacrylate, methacrylic acid, and hydroxyethyl methacrylate; about 1 to 7 percent by weight of a cross-linking agent; about 0.01 to 0.5 percent by weight of a thermal acid generator; about 0.01 to 1 percent by weight of a photoacid generator; about 0.00001 to 0.001 percent by weight of an organic base; and a solvent.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner SAMSUNG ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products