93results about How to "Reduce in quantity" patented technology

An atomization assembly configured to be combined with a battery assembly to form an electronic cigarette comprises a mouthpiece and a body detachable with the mouthpiece. The body includes an open end to discharge smoke into the mouthpiece, an oil storage cavity for storing tobacco oil is defined inside the body, a receiving groove is defined at the open end, an filler hole connected to the oil storage cavity is defined on a bottom wall of the receiving groove, and an elastomeric seal for sealing up the filler hole is received in the receiving groove. By implementing the filler hole, it is easier to add the tobacco oil, and by implementing the elastomeric seal, the tobacco oil can be avoided leaking out. Further, the atomization assembly is provided with simple structure, compact connection and easy assembly.

A developing device for use with an image forming apparatus, includes: a developer carrying member for carrying a developer; a developer regulating member for regulating an amount of the developer carried on the developer carrying member; a first frame for supporting the developer regulating member; a fixing member for fixing the developer regulating member to the first frame; a second frame mounted to the first frame; and a molded resin portion formed by injecting a melted resin material into a space defined by the first and second frames. The molded resin portion is engaged with a first limiting portion provided as a part of the fixing member and projected into the space and is engaged with a second limiting portion provided as a part of the second frame to connect the first and second frame.

A low-voltage electrical switchboard comprises a supporting structure, a busbar compartment and an apparatus compartment separated by a partitioning and insulating wall, characterized in that the partitioning and insulating wall has a first surface facing the busbar compartment which is provided with a plurality of retaining and supporting means for the busbars, and a second surface facing the apparatus compartment which is provided with a plurality of openings for insertion/extraction of first connection means between the busbars and the electrical apparatuses through the partitioning and insulating wall, the first connection means being provided with first insulation means that cooperate with the partitioning and insulating wall to increase the distance in air between the phases during insertion/extraction of the connection means, the low-voltage electrical switchboard being further provided with mechanical locking means for locking the one or more electrical apparatuses and preventing their insertion/extraction into/from an operating position in contact with the busbars under predetermined conditions.

A memory management system for managing memory of a processing system having a primary memory and at least one secondary memory is disclosed. The memory is managed by optimizing the number of writes required by swapping one or more relevant pages of an application from the primary memory to the at least one secondary memory. The system comprises of a dynamic memory manager for allocating memory to the application from a memory pool and having a first table containing virtual addresses and chunk sizes of memory allocated by the application. The system further comprises of a swap manager having a second table containing the physical addresses of the primary memory pages and information whether the pages are allocated or not. The system further comprises of a memory management unit having a third table containing a mapping information of the physical addresses and the virtual addresses of the one or more physical pages used by the application and information whether the page is dirty or not.

A power screwdriver (1) with a rotationally driven, axially displaceable mounted tool spindle (2) with a low-noise torque clutch (3) which comprises a ratchet-spring biased ratchet coupling (6) driven by a driven ratchet part (12) and a rigid slack clutch spring (7) biased claw coupling (8). The ratchet coupling (6) and the claw coupling (8) are combined using a common, axially displaceable, freely rotatable coupling sleeve (9). The ratchet coupling (6) has opposing oriented, peripheral inclined beveled cams (10) and the claw coupling (8) has opposing oriented catches (11). The driven ratchet part (12) and the coupling sleeve (9) are arranged freely rotatably on an intermediate sleeve (13), which is mounted freely rotatable and axially displaceable on the tool spindle (2). The ratchet spring (5) is arranged between the intermediate sleeve (13) and the coupling sleeve (9) and the clutch spring (7) is arranged between the intermediate sleeve (13) and the tool spindle (2).

The invention discloses a sound source localization method based on dual mini microphone arrays. The dual mini microphone arrays simulating human ears are introduced to the sound source localization method for the first time, the method of spatial clustering and energy analysis is introduced to phase transformation weighted controllable response power sound source localization algorithm, and the computing burden is effectively reduced through combination of the structural characteristics of the mini arrays. The sound source localization method based on the dual mini microphone arrays is simpleand understandable and clear in idea so that the present less researched microarray sound source localization algorithm can be greatly improved.

The invention discloses a three-dimensional storage and a formation method therefor. The three-dimensional storage comprises a substrate, a plurality of separated stacking layer structures, an isolation layer, a connecting structure and a plurality of inserting plugs, wherein the substrate comprises a device region and a connecting region which are arranged adjacently; the multiple separated stacking layer structures are positioned on the device region and the connecting region of the substrate; the stacking layer structures comprise multiple layers of stacked grids; the isolation layer is positioned on the device region, between adjacent stacking structures, of the substrate; the connecting structure is positioned on the connecting region of the substrate; the connecting structure is connected with the adjacent stacking structures; the connecting structure comprises multiple layers of stacked electric connecting layers; the two ends of each electric connecting layer are connected with the grids on the same layer in the adjacent stacking structures; the multiple inserting plugs are positioned on the surfaces of the grids in each layer; and each inserting plug is electrically connected with the grids in contact, the grids on the same layer with the grids in contact, and the electric connecting layers on the same layer with the grids in contact. By virtue of the formation method, the number of the inserting plugs can be reduced, the process can be simplified, the size of the storage can be reduced, and the space utilization rate of the chip can be improved.