Shaping die for chip package leads

Inactive Publication Date: 2008-11-27
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The invention provides a shaping die for chip package leads which improves the f

Problems solved by technology

In order to achieve thin small outline package in the TSOP process, the Lead On Chip (LOC) structure is commonly adopted during the plastic package process, so that after being plastic packaged the upper and lower resin layers for plastic packaging of the chip have different thickness, which in turn causes the upper and lower resin layers of the chip to be contracted differently during the cooling procedure after being plastic packaged, resulting in the warpage of the

Method used

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  • Shaping die for chip package leads
  • Shaping die for chip package leads
  • Shaping die for chip package leads

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Experimental program
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first embodiment

[0038]FIGS. 4 and 5 are the front view and the left view of the shaping die for chip package leads according to the invention respectively.

[0039]The shaping die for chip package leads shown in FIGS. 4 and 5 comprises a base portion 30 and lead pressing portions 31 extending from the opposite sides of the base portion 30. The lead pressing portions 31 and the bottom surface of the base portion 30 define a groove 33 for holding the TSOP package. The lead pressing portions 31 have contact portions 35 contacting with the TSOP package leads.

[0040]The base portion 30 is generally made from alloy materials with higher hardness. The inner surface of the groove 33 is planar. The groove 33 is configured to hold the TSOP package when shaping the TSOP package leads. Thus, the shape of the groove 33 matches with that of the TSOP package and the lateral dimension of the groove 33 is slightly bigger than that of the TSOP package to facilitate the receiving and holding of the TSOP package. The depth h

second embodiment

[0049]FIGS. 8 and 9 are the front view and the left view of the shaping die for chip package leads according to the invention respectively.

[0050]The shaping die for chip package leads shown in FIGS. 8 and 9 comprises a base portion 30 and lead pressing portions 31 extending from the opposite sides of the base portion 30. The lead pressing portions 31 and the bottom surface of the base portion 30 define a groove 33 for holding the TSOP package. The lead pressing portions 31 have contact portions 35 contacting with the TSOP package leads.

[0051]The inner surface of the groove 33 is planar. The groove 33 is configured to hold the TSOP package when shaping the TSOP package leads. Thus, the shape of the groove 33 matches with that of the TSOP package and the lateral dimension of the groove 33 is slightly bigger than that of the TSOP package to facilitate the receiving and holding of the TSOP package. The depth h of the groove 33 corresponds to the maximum distance between the leads and the s

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Abstract

Disclosed herein is a shaping die for chip package leads including a base portion, on which lead pressing portions are provided, the lead pressing portions having contact portions contacting with TSOP package leads, a groove for holding the TSOP package being formed between the lead pressing portions, wherein the depth of the groove, which is the minimum distance between a location of the groove where the TSOP package is held and the contact portions of the lead pressing portions, corresponds to the maximum distance between the leads and the surface of the TSOP package held by the groove. The flatness of the shaped leads in the invention is improved and the package will not be damaged during the shaping procedure.

Description

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Claims

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Application Information

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Owner SEMICON MFG INT (SHANGHAI) CORP
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