Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure

a technology of silicone gel and thermally conductive components, applied in the direction of conduction heat transfer modifications, electrochemical generators, semiconductor/solid-state device details, etc., can solve the problems of insufficient fluidity, difficult to precisely apply, latent heat, etc., to achieve excellent gap filling ability and precision in application properties, high peelability, and high fluidity of the entire composition

Active Publication Date: 2020-07-30
DOW TORAY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

This patented technology offers an improved way to make sure that there's no space left inside when adding more or less materials than what was needed without affecting its effectiveness. It achieves this through create a special type called Silicon Gel with very precise dimensions which allows it to stick tight around tiny parts like electronics while still allowing them to flow freely throughout their volume. Additionally, because these compositions have low elastic modulus they don’t crack easily during use due to differences in temperature changes over time. These technical improvements help keep things running smoothly at all times despite being too much stuffy or damaged from external factors such as impact force.

Problems solved by technology

The technical problem addressed in this patents relates to achieving efficient cooling while maintaining good flow characteristics when filling up small amounts of thermoconductor material into thickened areas on substrates containing integrated circuits. This requires a special kind of resin called Thermal Conduction Silicon Composite (TCSC) due to its ability to absorb excess energy effectively at higher temperatures compared to traditional methods involving adding more expensive metal particles.

Method used

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  • Thermally-conductive silicone gel composition, thermally-conductive member, and heat dissipation structure

Examples

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examples

[0093]The present invention will now be described with reference to examples, but the present invention is not limited thereto.

[0094]The components (A) to (E) were mixed as follows to obtain thermally conductive silicone gel compositions of Examples 1 to 6 and Comparative Examples 1 to 7.

[0095]The components (A), (D) and (E) were mixed in the number of parts as shown in Tables 1 to 3 (Examples 1 to 6 and Comparative Examples 1 to 7), and further mixed at 160° C. for 1 hour under reduced pressure. The resulting mixture was cooled to a normal temperature. After cooling, the components (B), (C) and other components shown in the table were added and uniformly mixed.

[0096][Preparing a Thermally Conductive Silicone Gel Cured Product]

[0097]A 12 mm high, 50 mm long, and 30 mm wide frame was made using a polyethylene backer on a polypropylene sheet, and filled with the obtained composition. A Teflon (registered trademark) sheet was pressed on the frame so as to form a smooth surface. This was t

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Abstract

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.

Description

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Claims

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Application Information

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Owner DOW TORAY CO LTD
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