A method is provided for forming a circuit-on-wire (CoW)
assembly. The method forms a flexible line with a plurality of periodic alignment marks used as a guide to place CoW devices overlying a surface of the flexible line. The CoW devices may be LEDs, capacitors, diodes, photodiodes, resistors, thin-film transistors, or combinations of the above-listed elements. The flexible line may be a conductive material, such as a
metal wire, and the periodic alignment marks may be vias formed through the wire. If the flexible line is
electrically conductive, an
electrically conductive adhesive may be applied to the
electrically conductive line, so that an
electrical connection is formed between the CoW devices and the electrically conductive line. Subsequent to placing the CON devices, processes may be formed on the flexible line and CoW devices such as lithographic
etching and thin-film deposition. An
active matrix array using CoW devices is also presented.