Fabrication Process Using Circuit-on-Wire
a technology of circuit-on-wire and fabrication process, applied in the field of display fabrication, can solve the problems of backplane fabrication, optical transparency, same problems as active matrix array, etc., and achieve the effect of low cos
Active Publication Date: 2015-08-06
SHARP KK
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Benefits of technology
The patent describes a method for creating low-cost display panels using inorganic LEDs. The method involves integrating LED devices onto thin metal wires that are then woven together to create a pixelated pattern. The pixels work in cooperation with electronics signals sent through the wires. The method also includes creating a flexible line with alignment marks and placing the LED devices over the line, using an adhesive if necessary. The method can be used to create a matrix of LED devices along the flexible line. The resulting assembly can be spooled for storage. The technical effects of the method include reducing production costs and creating flexible display panels.
Problems solved by technology
Another important issue in display backplane fabrication is optical transparency.
Note: although a display backplane is depicted, the same issues apply to an active matrix array that receives and processes light, such as a charge-coupled device (CCD) camera.
For very small pixels, the effective pixel area (expressed often by the term aperture ratio) tends to become prohibitively small.
The majority of LED displays are based on organic LEDs (OLEDs), a technology that is plagued by issues with product lifetime due to blue efficiency, sensitivity to humidity, and oxygen, in addition to high manufacturing costs.
Inorganic LEDs can resolve issues of lifetime and environmental sensitivity, but they are difficult to scale to large substrate sizes.
Method used
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Embodiment Construction
[0030]FIG. 3 is a plan view of an active matrix array. The array 300 comprises a plurality of pixels 302-0,0 through 302-m,n, where m and n are integers greater than one. Using pixel 302-0,0 as an example, each pixel has a center 304-0,0 and further comprises a first conductive line 306-0 and a parallel second conductive line 306-1 aligned in a first direction 308. An active line 310-0 is aligned in a second direction 312 orthogonal to the first direction 308 and mechanically connected to the first conductive line 306-0 and second conductive line 306-1. The active line 310-0 bisects the center 304-0,0 of pixel 302-0,0. For example, the active line may be relatively flat or oval in its cross-section (not shown).
[0031]A circuit-on-wire (CON) device 314-0,0 overlies an outer surface of the active line 310-0 and is electrically connected to the first conductive line 306-0, second conductive line 306-1, or both the first and second conductive lines. Here, the CoW device is represented as...
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A method is provided for forming a circuit-on-wire (CoW) assembly. The method forms a flexible line with a plurality of periodic alignment marks used as a guide to place CoW devices overlying a surface of the flexible line. The CoW devices may be LEDs, capacitors, diodes, photodiodes, resistors, thin-film transistors, or combinations of the above-listed elements. The flexible line may be a conductive material, such as a metal wire, and the periodic alignment marks may be vias formed through the wire. If the flexible line is electrically conductive, an electrically conductive adhesive may be applied to the electrically conductive line, so that an electrical connection is formed between the CoW devices and the electrically conductive line. Subsequent to placing the CON devices, processes may be formed on the flexible line and CoW devices such as lithographic etching and thin-film deposition. An active matrix array using CoW devices is also presented.
Description
RELATED APPLICATIONS[0001]This application is a Continuation-in-Part of an application entitled, CIRCUIT-ON-WIRE, invented by Voutsas et al, Ser. No. 14 / 169,202, filed Jan. 31, 2014, attorney docket No. SLA3377, which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]This invention generally relates to display fabrication and, more particularly, to a circuit-on-wire (CoW) technology useful in the fabrication of large array electronic panels.[0004]2. Description of the Related Art[0005]The fabrication of backplane arrays for various types of flat panel displays, such as liquid crystal display (LCD) or organic light emitting diode (OLED), requires multiple deposition and photolithographic patterning (selective etching) steps. These steps must take place using specialized process equipment capable of handling the substantial size of the substrates typically used for display manufacturing. In that sense, the manufacturing cost is a funct...
Claims
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IPC IPC(8): H01L27/12H01L27/15
CPCH01L27/124H01L27/1259H01L27/156H01L25/0753H01L27/1288H01L29/78603H01L2924/0002H01L2924/00
Inventor VOUTSAS, APOSTOLOS
Owner SHARP KK
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