Ic socket having heat dissipation function

[0034] figure 1 Is an external perspective view of the IC socket 1 according to the present invention, and figure 2 Yes figure 1 A schematic lateral cross-sectional view of the IC socket 1 shown. The IC socket 1 is provided on a printed circuit board 2 and has a socket main body 3 made of an insulating material such as resin, and a frame 4 that can move upward and downward with respect to the socket main body 3 and is biased upward. In addition to the frame 4, the IC socket 1 also has constituent elements such as nesting, guides, and levers. Since these additional constituent elements are known, for the sake of simplification, their description is omitted, and they are also not mentioned in figure 2 Shown in. Such as figure 2 As shown, the socket body 3 has a plurality of contactors, namely a first contact pin 6a and a second contact pin 6b, which are used to place the BGA device 5 (measured and arranged on the upper half) under the BGA device 5. The raised area is electrica