Packaging method of light-emitting or light-receiving diode

A technology of photodiode and packaging method, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of difficult heat conduction function and high cost, and achieve the effect of improving heat conduction function and reducing the packaging volume

Inactive Publication Date: 2013-01-23
俞宛伶
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention relates to improving heat dissipation from LED packages by optimizing their placement on specific areas within them. This helps improve performance without adding extra weight or thickness.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the efficiency at which LEDs generate waste energy during their use without sacrificially increasing its size due to the limitations associated with current methods such as solder connections between components that require separate steps like applying adhesives before attaching them together.

Method used

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  • Packaging method of light-emitting or light-receiving diode
  • Packaging method of light-emitting or light-receiving diode
  • Packaging method of light-emitting or light-receiving diode

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Embodiment Construction

[0012] The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art can implement them after studying this specification.

[0013] refer to figure 1 , a flow chart of the packaging method of the light-emitting or light-receiving diode of the present invention. The packaging method S1 of the light-emitting or light-receiving diode of the present invention includes: a spacer plate preparation step S11, a pressing step S13, a drilling step S15, a metal connection step S17, a cutting step S19, and a sealing step S21.

[0014] The spacer plate preparation step S11 is to prepare a spacer plate, and the spacer plate has a plurality of crystal die cavities, each of which is used to carry and accommodate at least one light-emitting or light-receiving diode die; the pressing step S13 is to combine multiple The light-emitting or light-receiving diode die is placed in the die cavity, an

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Abstract

The invention relates to a packaging method of a light-emitting or light-receiving diode, which comprises the following steps of: preparing a spacing board, wherein the spacing board is preformed with multiple crystal grain molding cavities; arranging the spacing board above a bonding layer and a metal foil; arranging crystal grains of the light-emitting or light-receiving diode into the crystal grain molding cavities, and performing press fit; then forming guide holes in the spacing board and/or bonding layer and/or metal foil close to crystal grain electrodes of the diode; and then, based on electroless dip plating, electroplating, image transferring, etching and other printed circuit board technologies in the prior art, forming a metal circuit as a welding pin on the metal foil below the crystal grains of the light-emitting or light-receiving diode, and respectively communicating the crystal grain electrodes of the diode with the welding pin through the guide holes. According to the method, the packaging volume can be reduced; and by properly selecting the quantity, dimension and position of the guide holes, the heat conduction function of the light-emitting or light-receiving diode packaging can be also improved.

Description

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Claims

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Application Information

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Owner 俞宛伶
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