10G PON (passive optical network) BOSA (bi-direction optical sub assembly) attached module
一种贴片、驱动电路的技术,应用在光通信领域,能够解决不利走线与布局、加剧光模块成本、不利光模块散热等问题,达到方便拆卸维修与升级更换、利于小型化、促进推广的效果
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Embodiment 1
[0038] see Figure 2-Figure 4 , in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected with the BOSA driving circuit. The BOSA sticker interface 1 is connected to the external equipment main board 5, and the external equipment main board 5 adopts an OLT. The BOSA paste interface 1 is provided with a pin row 4, which is arranged in two rows, and the pin row 4 is electrically connected with the BOSA drive circuit; the external device motherboard 5 is provided with a jack 6 that matches the pin row 4, and the pin row 4 is electrically connected to the BOSA driving circuit; 4 is inserted into the socket 6, and the BOSA device 2 is bonded on the PCB.
Embodiment 2
[0040] see Figure 5-Figure 7 , in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected to the BOSA drive circuit. The BOSA sticker interface 1 is connected to the main board 5 of the external device, and the main board 5 of the external device adopts ONT. SMD pins 7 are arranged on the BOSA paste interface 1, and the SMD pins 7 are arranged in two rows, and the SMD pins 7 are electrically connected to the BOSA driving circuit. The main board 5 of the external device is provided with pads 8 matched with the patch pins 7, the patch pins 7 are welded on the pads 8, and the BOSA device 2 is bonded on the PCB.
Embodiment 3
[0042] see Figure 8-Figure 11, in the 10G PON BOSA paste provided in this embodiment, the substrate 3 is a PCB board, and a BOSA drive circuit is integrated in the PCB board; the BOSA device 2 is attached to the PCB board, and the BOSA device 2 is electrically connected to the BOSA drive circuit; the PCB board There is a BOSA sticker interface 1 on the top, and the BOSA sticker interface 1 is electrically connected with the BOSA driving circuit. The BOSA sticker interface 1 is connected to the external equipment main board 5, and the external equipment main board 5 adopts an OLT. The BOSA paste interface 1 is provided with a pressing pin 9, and the pressing pin 9 is electrically connected with the BOSA driving circuit; the external device main board 5 is provided with a groove 10 matching the pressing pin 9, and the pressing pin 9 is pressed into the groove 10, and the BOSA device 2 is attached to the PCB. The 10G PON BOSA paste is fixed on the main board of the external dev...
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