High-performance heat-conducting pressure-sensitive adhesive and preparation method

A high-performance, pressure-sensitive adhesive technology, applied in the field of pressure-sensitive adhesives, can solve the problem of low thermal conductivity of thermally conductive adhesives, and achieve the effects of improving thermal conductivity, improving thermal conductivity and stability, and high composite strength

Inactive Publication Date: 2019-01-11
南京夜视丽精细化工有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of thermally conductive adhesives is generally low at present, so how to improve t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0024] Example 1: A high-performance thermally conductive pressure-sensitive adhesive provided by the present invention will now be described. The thermally conductive adhesive includes the following parts: 13 parts of ethyl methacrylate, 130 parts of ethyl acetate, 30 parts of butyl acrylate, and ethyl acrylate. 30 parts of ester, 16 parts of vinyl acetate, 6 parts of acrylamide, 2 parts of coupling agent, 4 parts of dispersant, 100 parts of inorganic heat conducting medium and 1 part of initiator.

[0025] In this embodiment, as an improvement of the present invention, the inorganic heat conducting medium uses carbon powder.

[0026] In this embodiment, as an improvement of the present invention, the diameter of the copper powder is 30 nanometers.

[0027] In this embodiment, as an improvement of the present invention, the initiator uses benzoyl peroxide.

[0028] In this embodiment, as an improvement of the present invention, the coupling agent is a silane coupling agent.

[0029] In t

Example Embodiment

[0037] Example 2: A high-performance thermally conductive pressure-sensitive adhesive provided by the present invention will now be described. The thermally conductive adhesive includes the following parts: 18 parts of ethyl methacrylate, 140 parts of ethyl acetate, 40 parts of butyl acrylate, and ethyl acrylate. 35 parts of ester, 20 parts of vinyl acetate, 8 parts of acrylamide, 4 parts of coupling agent, 6 parts of dispersant, 150 parts of inorganic heat conducting medium and 2 parts of initiator.

[0038] In this embodiment, as an improvement of the present invention, the inorganic heat conducting medium uses carbon powder and copper powder.

[0039] In this embodiment, as an improvement of the present invention, the diameter of the copper powder is 5 nanometers.

[0040] In this embodiment, as an improvement of the present invention, the initiator uses benzoyl peroxide.

[0041] In this embodiment, as an improvement of the present invention, the coupling agent is a rare earth coupli

Example Embodiment

[0050] Example 3: A high-performance thermally conductive pressure-sensitive adhesive provided by the present invention will now be described. The thermally conductive adhesive includes the following parts: 15 parts of ethyl methacrylate, 135 parts of ethyl acetate, 35 parts of butyl acrylate, and ethyl acrylate. 32 parts of ester, 18 parts of vinyl acetate, 7 parts of acrylamide, 3 parts of coupling agent, 5 parts of dispersant, 125 parts of inorganic heat conducting medium and 1.5 parts of initiator.

[0051] In this embodiment, as an improvement of the present invention, silica powder is used as the inorganic heat conducting medium.

[0052] In this embodiment, as an improvement of the present invention, the initiator uses benzoyl peroxide.

[0053] In this embodiment, as an improvement of the present invention, the coupling agent is a silane coupling agent and a rare earth coupling agent.

[0054] In this embodiment, as an improvement of the present invention, a method for preparing

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Abstract

The invention discloses a high-performance heat-conducting pressure-sensitive adhesive which comprises the following components: ethyl methacrylate, ethyl acetate, butyl acrylate, ethyl acrylate, vinyl acetate, acrylamide, a coupling reagent, a dispersing agent, an inorganic heat-conducting medium and an initiator. According to the invention, an ethyl acetate solution added with a surface treatingagent is adopted and the heating reflux reaction is performed, so that the possibility of full contact between liquid and power is increased; the powder surface is rich in abundant organic functionalgroups, so that the powder can excellently disperse and soak in the pressure-sensitive adhesive without agglomeration and the thermal conductivity and stability of the heat-conducting adhesive can befurther promoted; the surface modified inorganic heat-conducting medium is added into the pressure-sensitive adhesive, so that a stable network structure is formed under the cross-linking effect of the pressure-sensitive adhesive and the inorganic heat-conducting medium and the heat conductivity coefficient of the pressure-sensitive adhesive and the product thereof can be promoted.

Description

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Claims

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Application Information

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Owner 南京夜视丽精细化工有限责任公司
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