Display assembly, manufacturing method of display assembly and electronic equipment

A technology of a display assembly and a manufacturing method, applied in the field of screens, can solve the problems of large installation space, increase the thickness of electronic equipment, and the occupation of the main board, and achieve the effects of reducing installation space, ensuring performance, and saving thickness

Active Publication Date: 2020-02-28
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But this method will make the motherboard take up a large install

Method used

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[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0063] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0064]In addition, the desc

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Abstract

The invention discloses a display assembly, a manufacturing method of the display assembly and electronic equipment. The display assembly comprises a screen, a wiring layer group and a silicon-containing semiconductor, wherein the screen is provided with a display surface for displaying a picture, and a first conductive layer is arranged on the side, away from the display surface, of the screen; the wiring layer group is arranged on the surface, away from the screen, of the first conductive layer, and is electrically connected with the first conductive layer; and the silicon-containing semiconductor is electrically connected to the surface, away from the screen, of the wiring layer group. Through the technical scheme, the installation space of a main board is reduced, and the performance of the main board is guaranteed.

Description

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Claims

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Application Information

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Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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