31results about How to "Reduce thickness" patented technology

A method of forming conductive structures on the contact pads of a substrate,such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.

A method for producing titanium alloy brazing strips and the resulting brazing strips and/or foils. The method uses a cold-rolling process without heat treating to generate a titanium based multi-layer alloy strip or foil made up of discrete layers of titanium and an additional layer or layers of one or more metals, such as zirconium, nickel and/or copper, for example, or alloys thereof, with the layer of titanium roll bonded without heat treating to the layers of the additional metal(s). The resulting strip or foil can include, for example, Cu/Ti/Cu, Ni/Ti/Ni, Ni/Ti/Cu, Cu/Ni/Ti/Ni/Cu, Ni/Cu/Ti/Cu/Ni, Ni/Cu/Ni/Ti/Ni/Cu/Ni, Ni/Zr/Cu/Ti/Cu/Zr/Ni and Ni/Ti/Cu/Zr/Cu/Ti/Ni among other combinations. The resulting strip or foil can be used for brazing, creating an alloy of the weight percentage of the original materials.

With a conventional semiconductor device, there occurs deterioration in adhesion strength of bonded parts between a lid and a substrate. A semiconductor device according to an embodiment of the invention includes a substrate, a semiconductor chip with one of surfaces thereof, facing downward, mounted on the substrate, and a lid having a depressed part for accommodating the semiconductor chip, and a flange linked with the depressed part. Parts of the flange of the lid are bonded to the substrate by means of a binder. The flange is warped arcuately against the substrate, as seen in a side view. The bottom surface of the depressed part of the lid is bonded to the other surface of the semiconductor chip by means of a binder.

The invention discloses a display assembly, a manufacturing method of the display assembly and electronic equipment. The display assembly comprises a screen, a wiring layer group and a silicon-containing semiconductor, wherein the screen is provided with a display surface for displaying a picture, and a first conductive layer is arranged on the side, away from the display surface, of the screen; the wiring layer group is arranged on the surface, away from the screen, of the first conductive layer, and is electrically connected with the first conductive layer; and the silicon-containing semiconductor is electrically connected to the surface, away from the screen, of the wiring layer group. Through the technical scheme, the installation space of a main board is reduced, and the performance of the main board is guaranteed.

A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

A semiconductor package includes a semiconductor device and a passive component mounted and electrically coupled to a substrate. The passive component is disposed within a cavity portion formed on an upper surface of the substrate and the semiconductor device is disposed across the cavity portion of the substrate above the passive component.

The invention provides a diffusion barrier film, a composite film, a backlight module and a display device. The diffusion barrier film comprises a first barrier material layer, a diffusion material layer, a first substrate layer and a prism layer which are stacked in sequence. Because a diffusion film in the prior art and a barrier film on one side of a quantum dot layer are separately formed, substrate layers with high thicknesses are needed in the diffusion film and the barrier film respectively. However, in the diffusion barrier film, by reducing the substrate layer required by the diffusion film in the prior art and the substrate layer required by the barrier film on one side of the quantum dot layer, the thickness of the film layer structure which is assembled in the backlight moduleis effectively reduced, and light and thin development of the backlight module is facilitated.

A child safety seat comprises a seat structure having a base support surface for resting on a vehicle seat cushion, and a seating surface for a child occupant, the seating surface. A rigid link is attached to the child seat structure solely by a coupling mechanism that permits angular movement of the child seat structure relative to the rigid links about an axis located above the base support surface. A releasable connector is mounted on the rigid link for engagement with a standard anchorage unit associated with the vehicle seat. The child safety seat may be either forward facing or rearward facing.

A laundry treatment apparatus is disclosed. The laundry treatment apparatus includes a cabinet having an accommodation space formed therein to accommodate laundry, a laundry support member provided in the accommodation space, and a presser mounted to the laundry support member and configured to apply pressure to laundry to remove wrinkles from laundry. The presser includes a support part for supporting one surface of laundry, a hanger hook configured to be hung on the laundry support member, and a press part hingedly connected to the support part to apply pressure to the opposite surface of laundry.

A leg for attachment to a main body of a taxidermy mannequin includes first, second, and third portions, each having first and second ends. The first end of the first portion includes a connector for coupling to the main body. The first end of the second portion is connected to the second end of the first portion to form a first joint. At least one of the first or second portions has a first cut-away section proximate the first joint with a reduced thickness. The first end of the third portion is connected to the second end of the second portion to form a second joint. At least one of the second or third portions has a second cut-away section proximate the second joint with a reduced thickness.

A circuit interface device is presented. A circuit board is secured by a circuit board cover, a plurality of electrical contacts is disposed on the circuit board, and a connector cover is coupled to a front end of the circuit board, such that a socket disposed at one end of the connector cover is corresponding to an upper side of the electrical contacts of the circuit board, thereby forming a connector of the circuit interface device. As such, through a structural design of buckling the connector cover on the circuit board without completely covering the connector cover on outer edge of the circuit board, a thickness of the connector cover covering the circuit board cover is reduced.

The invention discloses a capacitor screen which comprises a first matrix layer, a first conductive layer, a mixing layer, a second conductive layer, a second matrix layer and a substrate sequentially arranged from top to bottom, wherein the mixing layer comprises a mixture of a cholesterol-phase liquid crystal and a macromolecular structure and an optical rotation agent for controlling the thread pitch of the cholesterol-phase liquid crystal; the first conductive layer comprises multiple parallel first transparent conductive electrodes, and a gap exists between adjacent two first transparent electrodes; and the second conductive layer comprises multiple parallel second transparent conductive electrodes, and a gap exists between adjacent two transparent electrodes. In the invention, the in-cell structural design of the capacitor screen is realized, and the flexibility of the capacitor screen is improved.

Disclosed is an LED light-incident method of an edge-lit backlight module. Light emitted by an is converged by a lens or a lens group that is arranged between the LED and a light guide structure, and then enters the light guide structure. When a thickness of the LED is larger than that of the light guide structure, the light emitted by the LED can completely enter the light guide structure after being converged, so that requirement of reducing a thickness of the light guide structure can be satisfied, and meanwhile light utilization efficiency can be ensured.

A surface mounting device-type light emitting diode (SMD-type LED) comprises a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof and a light-emission window which is opened so that light is emitted through the light-emission window; a lens formed on the package so as to cover the light-emission window; an LED chip formed on an electrode inside the package; a wire for electrically connecting the LED chip and the electrode; and a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window.

The invention discloses a rotating packed bed for treating ammonia-nitrogen wastewater, belongs to the technical field of wastewater treatment, and aims to provide therotating packed bed for treatingammonia-nitrogen wastewater. The rotating packed bed comprises a shell, wherein a gas inlet is formed in one side of the shell; a gas outlet is formed in the top of the shell; a liquid inlet and a liquid outlet are respectively formed in the bottom of the shell; an annular packing support frame is arranged in the shell; packing is arranged in the packing support frame; a tubular liquid distributoris arranged in the center of the packing support frame; a plurality of nozzles are arranged ina connecting pipe of the tubular liquid distributor; the center of the top of the packing support frame is connected with a driving device through a rotating shaft; a gas distributor is arranged at the gas inlet; and a plurality of liquid redistributors are arranged on the side wall, parallel to the rotating shaft, of the shell. According to the invention, ammonia nitrogen in the ammonia nitrogen wastewater can be controlled at a certain concentration, so that the ammonia nitrogen wastewater is discharged after reaching the standard.

A direct-type backlight module and a display. The direct-type backlight module comprises: a back plate, an optical assembly, a middle frame arranged on a front face of the back plate and located at the periphery of the optical assembly, and a cooling fin and a Mini LED lamp panel both located between the back plate and the optical assembly, wherein the cooling fin is connected to the back plate, the Mini LED lamp panel is connected to the cooling fin, and the optical assembly is connected to the middle frame and makes contact with the Mini LED lamp panel. The Mini LED lamp panel is used to make contact with the optical assembly, an OD value is zero, and light emitted by the Mini LED lamp panel may evenly irradiate on the optical assembly, so the thickness of the direct-type backlight module is greatly reduced.

A method of manufacturing a flash memory cell is disclosed. The method comprises the steps of forming an oxide film on a semiconductor substrate in which a device separation film is formed and then patterning the oxide film to expose the semiconductor substrate at a portion in which a floating gate will be formed; sequentially forming a tunnel oxide film and a first polysilicon layer on the entire structure, and then flattening the first polysilicon layer until the tunnel oxide film is exposed to form a floating gate; etching the tunnel oxide film and the oxide film in the exposed portion to a given thickness and the forming a dielectric film on the entire structure; sequentially forming a second polysilicon layer, a tungsten silicide layer and a hard mask and then patterning them to form a control gate; and injecting impurity ions into the semiconductor substrate at the both sides of the floating gate to form a junction region.

The invention relates to a touch display device and a preparation method for the same. The device comprises an upper Polaroid sheet, an optical sheet, a liquid crystal layer, a base plate, a lower Polaroid sheet and a touch sensing layer, wherein the optical sheet is formed by base material and an optical film arranged on the lower surface of the base material; the liquid crystal layer is formed by an upper orientation film, a lower orientation film, liquid crystal clamped between the upper and lower orientation films, and public electrodes and pixel electrodes driving the liquid crystal; the pixel electrode is arranged on the upper surface of the base plate; the touch sensing layer is formed by a polyimides film and a touch control electrode arranged on one surface of the polyimides film; and the touch sensing layer is arranged on the upper and lower surfaces of the upper Polaroid layer, the upper surface of the base material, the lower surface of the optical film, the upper surface of the pixel electrode or the lower surface of the base plate. The touch sensing layer is arranged on elements such as the Polaroid sheets of a display screen, so the display screen has a touch control function and assembly of a touch screen on the display screen is unnecessary; and thickness of the touch display device can be reduced, and material and assembling cost can be reduced.

The invention discloses a display module and a manufacturing method thereof. The display module sequentially comprises a display screen, a first absorption type polaroid, a first quarter-wave plate, an optical lens group and a convex lens assembly from a display side to a viewing side, and the optical lens group and the convex lens assembly share the same optical axis. The convex lens assembly comprises a convex lens, a second absorption type polaroid and an optical integrated element which are sequentially attached from the viewing side to the display side, wherein the optical integrated element comprises a second quarter-wave plate and a reflective polarizing film plated on one side face of the second quarter-wave plate or a nano-imprinted metal grating, and the reflective polarizing film or the metal grating is attached to the second absorption type polaroid. Wherein the absorption axis of the first absorption type polaroid is respectively parallel to the absorption axis of the second absorption type polaroid and forms an included angle of 45 degrees with the fast axis of the first quarter-wave plate; the fast axis of the second quarter-wave plate and the grating extension direction of the metal grating form a 45-degree included angle, the fast axis of the second quarter-wave plate and the light-transmitting axis of the reflective polarizing film form a 45-degree included angle, and the fast axis of the second quarter-wave plate and the absorption axis of the second absorption type polarizer form a 45-degree included angle.