LED packaging structure and manufacturing method thereof
A technology of LED packaging and manufacturing methods, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of serious light absorption and low brightness of black glue, and achieve the effects of increasing brightness, improving contrast, and preventing cross-lighting
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[0041]Example 1
[0042]This embodiment provides an LED package structure, referenceFigure 1-2 Including substrate 1, LED chip, transparent glue layer 2, white rubber layer 3, black rubber layer 4; LED chip is RGB chip.
[0043]The LED chip (not shown) is disposed on the substrate 1; the transparent glue layer 2 is laid on the substrate 1, and is coated on the LED chip; the transparent collapsed layer 2 is used to diverge with the LED chip emitted, and the light color of the LED is uniform. Sex; the white gelatin layer 3 is disposed outside the transparent glue layer 2 for reflecting the light on the white glue layer 3, avoiding a large amount of light absorbed by the black gum layer 4, improves the brightness of the LED; black rubber layer 4 Around the white glue layer 3, the contrast can be improved, and the light emitted by other LED chips is used to prevent the LEDs from appearing in a string light. The transparent collant layer 2, the surface of the white gelatin layer 3 and the black g
Example Embodiment
[0046]Example 2
[0047]This embodiment provides a method of fabricating the LED package structure as described in Example 1. The following steps:
[0048]referenceFigure 4-6In step S10, the first wall 5 is enabled at the outer edge of the substrate 1, and the first wall 5 forms a groove 6 with the substrate 1, and the liquid-state transparent glue is added to the groove 6, and the liquid transparent glue is solidified. Layer 2;
[0049]Specifically, there are a plurality of LED chips (not shown) on the substrate 1; after the first wall 5 is provided on the substrate 1, the first wall 5 forms a groove 6 with the substrate 1, and the liquid transparent glue is added to form a transparent glue layer. 2.
[0050]In some embodiments, after S10 steps,
[0051]S11, polishing the surface of the transparent adhesive layer 2 to a preset target height.
[0052]referenceFigure 7 , S20, slotting the transparent collant layer 2, the surface of the transparent collant layer 2 forms a first slot 7 of the mesh structur
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