Polyamic acid composition, polyimide composition, polyimide film and polyimide copper-clad plate

The invention relates to the technical field of functional polymers, and in particular, relates to a polyamic acid composition and a preparation method thereof. The polyamic acid composition comprises polyamic acid and a bonding additive, the bonding additive is selected from at least one of a pyridine derivative and a pyrimidine derivative, the pyridine ring of the pyridine derivative is optionally monosubstituted or polysubstituted by -NH2, -OH and -CH2OH, and the pyridine ring of the pyrimidine derivative is optionally monosubstituted or polysubstituted by -NH2 and -OH. The polyamide acid composition is prepared by adding the pyridine derivative or the pyrimidine derivative as a bonding aid, and the polyimide composition, a polyimide film and a polyimide copper-clad plate which are prepared by applying the polyamide acid composition and have high bonding strength are provided, so that the bonding force of polyimide and a copper surface is remarkably improved, the polyimide can be used as an interlayer dielectric material in wafer-level fan-out type packaging or large-board-level fan-out type packaging of high-frequency communication, and thus the problem of low binding force between a current polyamide acid glue solution for a rewiring layer and copper is solved.