Automatic alignment parallel seal welding method for microelectronic packaging in high vacuum state

The invention discloses an automatic alignment parallel seal welding method for microelectronic packaging in a high vacuum state, and solves the problem of how to complete high-quality parallel seal welding of a cover plate and a tube shell of a thin-shell device at low cost in a vacuum environment. A floating parallel welding wheel support is arranged, two parallel welding wheels on the support are pressed on parallel welding seams between a cover plate and a tube shell in a floating mode, weights are arranged at the top end of the parallel welding wheel support, and the welding pressure of the parallel welding wheels on the welding seams is adjusted by increasing or reducing the number of the weights. The adjustment of self-adaptive welding pressure in the welding process is realized; a shoulder-pole-shaped semi-square-shaped jacking frame body is arranged between a left parallel welding wheel support and a right parallel welding wheel support, the floating parallel welding wheel supports are lifted and lowered through jacking connection of an eccentric wheel to the semi-square-shaped jacking frame body, a tray conveying driving motor is installed outside a closed cavity, and conveying of trays in the cavity is completed at low cost; and the cover plate and the tube shell can be accurately aligned.