Thermally developable materials with buried conductive backside coatings

a backside coating and developable material technology, applied in the field of thermal and photothermographic materials, can solve the problems of distinctly different problems, increased formation of various types of “fog” or other undesirable sensitometric side effects, and much effort in the preparation and manufacture of photo-thermographic materials, and achieve the effect of reducing the manufacturing cost of backside layers and low cos

Inactive Publication Date: 2007-10-18
CARESTREAM HEALTH INC
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AI Technical Summary

Benefits of technology

This patented technology allows for create hidden electrically conductive structures on materials by combining nano particles made up of metals like silver (Ag) together with certain types of antiwears agents called lithium chloride(LiCl). Liquid solutions containing these components are applied onto various substrates before curing them at room temperature. By adding this mixture between two different polarities of water molecules, we get better results when used over large areas compared to traditional methods where only one type of agent was present.

Problems solved by technology

The technical problem addressed in this patents is finding new ways to improve the performance of coatings made from heat developing materials without adding extra ingredients like metrologenbiletants or anti-electrode shortcomings associated with current methods involving ion exchange processes.

Method used

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  • Thermally developable materials with buried conductive backside coatings
  • Thermally developable materials with buried conductive backside coatings

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example 1

[0317] Buried Conductive Backside Layer Formulations:

[0318] Buried conductive backside layer formulations containing zinc antimonate were prepared as described below. In all samples the ratio of CELNAX® CX-Z641M to binder was held constant at 2.73:1 and the ratio of antistatic compound to CELNAX® was varied.

[0319] A dispersion was prepared by adding 33.76 parts of MEK to 15.8 parts of CELNAX® CX-Z641M (containing 60% non-acicular zinc antimonate solids in methanol −9.51 parts net). The addition took place over 15 minutes under strong mixing. Stirring was maintained for an additional 15 minutes.

[0320] A polymer solution was prepared by dissolving 1.38 parts of VITEL® PE-2700B LMW and 2.09 parts of CAB 381-20 in 82.5 parts of MEK. The polymeric binders were selected to provide excellent adhesion between the unprimed polyethylene terephthalate support and the outermost backside layer as described in U.S. Pat. No. 6,689,546 (noted above). The binders do not have any appreciable conducti

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Abstract

Thermally developable materials including photothermographic and thermographic materials have a buried conductive backside layer comprising one or more binder polymers in which are dispersed each of at least two types of conductive materials: (1) nanoparticles of one or more conductive metal compounds, and (2) one or more organic solvent soluble inorganic alkali metal salt antistatic compounds. These buried conductive backside coatings provide conductivity that is affected minimally by humidity.

Description

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Claims

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Application Information

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Owner CARESTREAM HEALTH INC
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