Method for depositing a dielectric material

[0030]The present invention will now be described more specifically with reference to the accompanying drawings as well as the associated embodiments. It is to be noted that the following descriptions of the preferred embodiments of this invention are presented herein for the purpose of illustration and description only; it is not intended to be exhaustive or to be limited to the precise form disclosed.

[0031]Please refer to FIG. 4, which is the time diagram showing the pulse-purge deposition method according to the present invention, where the X-axis shows the action contents; while the Y-axis indicates the timing. The actions from top to bottom in the X-axis in FIG. 3 are listed in the followings: action (1′): pulsing the first material; action (2′): purging; and the action (3′): pulsing oxidant O. Form the time-frame perspective as shown in FIG. 4, action (1′) is performed in the time period T1, action (2′) is performed in the time period T2, action (3′) is performed in the time p...