Semiconductor device and method of manufacturing semiconductor device

2. Second Embodiment (An example semiconductor device including three substrates laminated together)

3. Modification Example 1 (An example in which a leading electrode is further provided on the surface S2 of the second substrate)

4. Third Embodiment (An example semiconductor device provided with a circuit having a communication function on the first substrate)

5. Modification Example 2 (An example in which an antenna is further provided in addition to the circuit having the communication function)

(1-1 Configuration of Semiconductor Device)

[0035]FIG. 1 illustrates a schematic configuration of a semiconductor device (semiconductor device 1) according to a first embodiment of the present disclosure. The semiconductor device 1 includes a first substrate 100 and a second substrate 200 electrically coupled to each other and laminated together. The semiconductor device 1 is, for example, a laminated image sensor, in which the first substrate 100 is provided with a pixel section 110 and the second substrate 200 is provided with a logic circuit 210 and a memory section 220. In the present embodiment, the logic circuit 210 is provided on a surface (first surface, surface S1), of the second substrate, facing the first substrate 100, and the memory section 220 is provided on a surface (second surface, surface S2), of the second substrate 200, opposite to the surface facing the first substrate 100.

[0036]Unit pixels are two-dimensionally arranged on the pixel section 110 of the first substra