Liquid resin composition for compression molding and electronic component apparatus
Pending Publication Date: 2020-06-11
NAMICS CORPORATION +1
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[0015]In accordance with an aspect of the invention, a liquid resin composition for compression molding, which can suppress the occurrence of the
Problems solved by technology
However, the warpage of the sealed silicon wafer is prone to occur, the warpage becomes problematic in each step of subsequent transportation, grinding, inspection, and the singulation
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Abstract
A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).
Description
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Owner NAMICS CORPORATION
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