Composite substrate material and process for producing the same

a substrate material and composite technology, applied in the field of composite substrate materials, can solve the problems of high cost, low long-term reliability of adhered areas, and optical scattering and reflection loss, and achieve high bond strength, good environmental temperature resistance characteristics, and long-term reliability.

Inactive Publication Date: 2005-08-09
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for easy production of composites made up of different types of layers by exposure to specific lights without losing their effectiveness over time due to factors including moisture evaporation during manufacturing processes. By combining these layers together into one structure, they form strong bonds between them while still being able to absorb water vapor effectively. Additionally, there is no requirement for any dry clean steps after assembly because all components have been treated properly beforehand. Overall, this method simplifies the overall fabrication process and improves its durable properties.

Problems solved by technology

The technical problem addressed in this patents relating to improving the performance and lifespan of semiconductor devices during use has resulted from various factors including optically scattered light (OIS), reflected signal power losses due to interference between layers on top of one another, thermal stress issues associated with temperature changes affecting device properties like reflectivity, threshold voltage shifts over time, etc., and moisture absorption effects causing damage to sensitive components inside these systems.

Method used

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  • Composite substrate material and process for producing the same
  • Composite substrate material and process for producing the same

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Embodiment Construction

[0025]The present invention will hereinbelow be described in further detail with reference to the accompanying drawings.

[0026]FIGS. 1A, 1B, 1C, and 1D show steps in a first embodiment of the process for producing a composite substrate material in accordance with the present invention.

[0027]Firstly, as illustrated in FIG. 1A, two Si wafers 10 and 20, which act as substrate materials, are prepared. The Si wafers 10 and 20 respectively have surfaces 10a and 20a, which have been subjected to mirror finish. Thereafter, TiO2 thin films 11 and 21, which act as functional films having photo-catalytic effects, are respectively formed on the surfaces 10a and 20a. In this embodiment, each of the Si wafers 10 and 20 has a thickness of 300 μm. Also, the TiO2 thin films 11 and 21 can be formed with, for example, a sputtering technique or a sol-gel technique.

[0028]Thereafter, as illustrated in FIG. 1B, the surface of each of the TiO2 thin films 11 and 21 is exposed to ultraviolet light 30 having a wa

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Abstract

A functional film, which has photo-catalytic effects, is overlaid on a surface of each of at least two substrate materials. The functional film, which has been overlaid on the surface of each of the substrate materials, is exposed to light having a wavelength falling within an absorption wavelength range of the functional film. The substrate materials are then bonded to each other with the functional films, which have been exposed to the light, intervening between the substrate materials. The functional film may be a film containing TiO2, and the light irradiated to the functional film may be ultraviolet light. In cases where a film other than the functional film is also overlaid on the surface of each of the substrate materials, the functional film is formed as a top layer.

Description

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Claims

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Application Information

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Owner FUJIFILM CORP
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