7 results about "Resistive element" patented technology

A semiconductor integrated circuit having a built-in PLL circuit which has two charge pump circuits for charging and discharging capacitive elements of a loop filter in response to signals generated by a phase comparator circuit. One of the two charge pump circuits has current sources which generate current values smaller than those generated by current sources of the other charge pump circuit. The loop filter has a first capacitive element connected to a charge/discharge node, and a second capacitive element connected to the charge/discharge node through a resistive element. The first capacitive element is charged and discharged by the one charge pump circuit, while the second capacitive element is charged and discharged by the other charge pump circuit. A charging current source of the one charge pump circuit operates simultaneously with a discharging current source of the other charge pump circuit, i.e., the charge pump circuits operate in opposite phase.

A resistive element includes: a semiconductor substrate; a first insulating film deposited on the semiconductor substrate; a resistive layer deposited on the first insulating film; a second insulating film deposited to cover the first insulating film and the resistive layer; a first electrode deposited on the second insulating film and electrically connected to the resistive layer; a relay wire deposited on the second insulating film without being in contact with the first electrode, and including a resistive-layer connection terminal electrically connected to the resistive layer and a substrate connection terminal connected to the semiconductor substrate with an ohmic contact; and a second electrode deposited on a bottom side of the semiconductor substrate, wherein a resistor is provided between the first electrode and the second electrode.

The invention provides a semiconductor device and a semiconductor device fabrication method. The semiconductor device includes as a resistance element a first polycrystalline silicon and a second polycrystalline silicon containing impurities, such as boron, of the same kind and having different widths. The first polycrystalline silicon contains the impurities at a concentration CX. The second polycrystalline silicon has a width larger than a width of the first polycrystalline silicon and contains the impurities of the same kind at a concentration CY lower than the concentration CX. A sign of a temperature coefficient of resistance (TCR) of the first polycrystalline silicon changes at the concentration CX. A sign of a TCR of the second polycrystalline silicon changes at the concentration CY. A change in the resistance value of the resistance element caused by the operation of the semiconductor device and deterioration in the performance of the semiconductor device caused by the change in the resistance value of the resistance element are suppressed.

The invention discloses a high-temperature resistance element and a preparation method thereof. The top of a machining table is fixedly connected with a conveying belt and a top frame, the top of the top frame is fixedly connected with a stamping assembly, and the bottom of the stamping assembly penetrates through the top of the top frame and extends to the position below the top frame; the bottom end of a stamping rod of the stamping assembly is fixedly connected with a stamping block. According to the high-temperature resistance element and the preparation method thereof, which relate to the technical field of resistance, after the thin plate is conveyed below the stamping block, the stamping assembly is started to drive the stamping block to descend for stamping, during stamping, extrusion rods on the two sides extrude the two sides of the thin plate, and under the impact of counter-acting force, a connecting block is driven to stretch a reset spring to move upwards, and a workpiece generated by stamping slides and falls to a collecting frame along a discharging groove; during stamping, the two sides of the stamping part are extruded through the extrusion rods on the two sides, deformation of the stamping part caused by warping of the two sides is prevented, and the quality of a stamped finished product is improved.