Down-hole pressure and weighing sensing system chip

A technology of weighing sensor and system chip, which is applied in the direction of wellbore/well components, measurement, earthwork drilling and production, etc. It can solve the problems of pressure resistance, poor corrosion resistance, real-time measurement of sensors, and inability to meet downhole operations, etc., to achieve High integration, low price, space-saving effect

Inactive Publication Date: 2014-01-22
黄正宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the sensing system chip connected to the sensor generally has poor pressure resistance and corrosion resistance, and can only monitor a single physical quantity information for one sensor.
Many sensors are limited by their own technology and cannot perform real-time measurement, monitoring and data transmission in harsh environments
Such a sensor system chip cannot meet the needs of downhole operations
[0007] For high-precision sensing system chips suitable for downhole operations, they are all in the research and development stage. Due to the low integration of multiple chips used in the research and development process, the system has poor stability and large errors in transmission data.
[0008] At present, there is no one that can measure the physical quantities of different sensors at the same time and transmit the data information in real time according to different customer needs; at the same time, it has high integration, high stability, accurate transmission data, low price, and can be effective at the same time. Save space, reduce cost, real-time monitoring and remote monitoring of equipment and instruments; sensor system chip that can meet the needs of most sensors for versatility and downhole operations

Method used

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  • Down-hole pressure and weighing sensing system chip
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  • Down-hole pressure and weighing sensing system chip

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0033] Example 1, figure 1 It is a schematic diagram of an overall module for monitoring and data transmission of multiple pressure sensors in a downhole pressure and weighing sensor system chip of the present invention;

[0034] Such as figure 1 Shown: a downhole pressure and weighing sensor system chip is composed of a substrate, the chip is welded on the substrate, and 28 pins are provided on the chip, characterized in that: the pins of the chip pass through the substrate pins Connect with 4 pressure sensors and 1 temperature sensor respectively; on the chip are equipped with channel switching module, digital-analog conversion module, power supply module, adjustable gain module, analog-digital conversion module, data processing module, and data serialization module , Bus power taking module, voltage / current conversion module, adjustable clock module and digital current ring ratio bus, each functional module is connected by electrical connection.

[0035] Such as figure 1 Shown: a

Example Embodiment

[0057] Example 2, figure 2 It is a schematic diagram of an overall module that can monitor and transmit data to a single pressure sensor in a downhole pressure and weighing sensor system chip of the present invention;

[0058] Such as figure 2 As shown, a downhole pressure and weighing sensor system chip is composed of a substrate, the chip is welded on the substrate, and 12 pins are provided on the chip, characterized in that: the pins of the chip pass through the substrate pins Connect with 1 pressure sensor and 1 temperature sensor respectively; on the chip are equipped with digital-to-analog conversion module, power supply module, adjustable gain module, analog-to-digital conversion module, data processing module, data serialization module, bus power supply Modules, voltage / current conversion modules, adjustable clock modules, and digital current ring ratio bus, and each functional module is connected by electrical connection.

[0059] Such as figure 2 As shown, a downhole pr

Example Embodiment

[0081] Example 3, figure 1 It is a schematic diagram of an overall module for monitoring and data transmission of multiple pressure sensors in a downhole pressure and weighing sensor system chip of the present invention;

[0082] Such as figure 1 Shown: a downhole pressure and weighing sensor system chip is composed of a substrate, the chip is welded on the substrate, and 16 pins are provided on the chip, characterized in that: the pins of the chip pass through the substrate pins Connect with 3 pressure sensors and 1 temperature sensor respectively; on the chip are equipped with channel switching module, digital to analog conversion module, power supply module, adjustable gain module, analog to digital conversion module, data processing module, data serialization module , Bus power taking module, voltage / current conversion module, adjustable clock module and digital current ring ratio bus, each functional module is connected by electrical connection.

[0083] Such as figure 1 Shown:

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PUM

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Abstract

The invention discloses a down-hole pressure and weighing sensing system chip, and relates to a semiconductor integrated circuit. The down-hole pressure and weighing sensing system chip is characterized in that the pins of the chip are connected with more than one pressure sensor and one temperature sensor through pins of a substrate, the chip is provided with a digital-to-analog conversion module, a power module, an adjustable gain module, an analog-to-digital conversion module, a data processing module, a data serialization module, a bus electricity obtaining module, a voltage/current conversion module, an adjustable clock module and a digital current chain relative ratio bus, and all the function modules are electrically connected. The down-hole pressure and weighing sensing system chip has the advantages of being high in integration level, high in stability, accurate in data transmission, low in cost, capable of effectively saving space and lowering cost, and capable of meeting needs of generality and operation in severe down-hole environment of most sensors by arranging the digital-to-analog conversion module and a general memorizer in the sensing system chip.

Description

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Claims

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Application Information

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Owner 黄正宇
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