Cooling device and semiconductor refrigeration equipment

A heat dissipation device and semiconductor technology, applied in lighting and heating equipment, refrigerators, refrigeration and liquefaction, etc., can solve the problem of high energy consumption of semiconductor refrigeration equipment, achieve the effect of reducing energy consumption and improving heat dissipation capacity

Active Publication Date: 2016-06-29
QINGDAO HAIER SPECIAL ICEBOX
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology uses an improved way to remove excessive amounts of waste generated during manufacturing processes while maintaining good performance levels on electronic devices such as computer chips or other components. By utilizing this technique, it saves money compared to traditional methods like water sprays or forced convection systems.

Problems solved by technology

This patented technical problem addressed in this patents relates to improving efficiency when utilizing semi-controlled cryogenic devices such as reefroger or wineglasses that require low temperatures during their operation while still being able to efficiently release excessive amounts of thermal power without consuming too much electricity.

Method used

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  • Cooling device and semiconductor refrigeration equipment
  • Cooling device and semiconductor refrigeration equipment
  • Cooling device and semiconductor refrigeration equipment

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Embodiment Construction

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] Such as Figure 1-Figure 2 As shown, the semiconductor refrigeration equipment in this embodiment includes at least two heat conduction inner tanks 100 spaced apart from each other, each of the heat conduction inner tanks 100 is provided with a semiconductor refrigeration module, and the semiconductor refrigeration module includes a semic

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PUM

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Abstract

The invention provides a cooling device and semiconductor refrigeration equipment. The cooling device comprises a plurality of radiators. Each radiator comprises a heat conductor, a plurality of heat pipes, a cooling fin set and a fan, wherein the heat pipes are connected to the heat conductor, the cooling fin set is connected to the heat pipes, and the fan and the cooling fin set are arranged side by side. An auxiliary heat pipe is further connected to each heat conductor, and the auxiliary heat pipe in any radiator is further connected with at least one cooling fin set in the rest of the radiators. Heat at the heat ends of semiconductor refrigeration modules is absorbed by means of the heat conductors, the heat conductors can transmit the heat to the cooling fin sets with large cooling areas through the heat pipes for automatic cooling, and the requirement for powering on the fans all the time for air cooling is avoided; and in addition, the heat conductors can conduct cooling by utilizing the cooling fin sets in the multiple radiators at the same time, so that the multiple cooling fin sets are in the cooling state all the time, and accordingly the cooling capacity of the multiple cooling fin sets is brought into full play, the cooling capacity of the semiconductor refrigeration equipment is improved, and energy consumption of the semiconductor refrigeration equipment is reduced.

Description

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Claims

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Application Information

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Owner QINGDAO HAIER SPECIAL ICEBOX
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