Water-based adhesive with high conductivity and preparation method of water-based adhesive with high conductivity
An adhesive and high-conductivity technology, applied in the direction of conductive adhesives, non-polymer adhesive additives, monocarboxylate copolymer adhesives, etc., can solve low adhesive strength, yellowing by high temperature, Complicated and cumbersome process steps and other issues, to achieve the effect of good stability and wide application
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Embodiment 1
[0030] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:
[0031] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 75°C;
[0032] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Silicone monomer parts, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate were added to the reactor and mixed evenly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water was 0.3:1:2, and The weight of the three components accounts for 55% of the total weight of the adhesive, and carbon nanotubes account for 40% of the total weight of the adhesive;
[0033]
Embodiment 2
[0038] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:
[0039] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 85°C;
[0040] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Silicon monomer, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate were added into the reactor and mixed uniformly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water was 0.7:1:3, and The weight of the three components accounts for 75% of the total weight of the adhesive, and carbon nanotubes account for 20% of the total weight of the adhesive;
[0041] (
Embodiment 3
[0049] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:
[0050] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 75°C;
[0051] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Add silicon monomer parts, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate into the reactor and mix evenly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water is 0.3:1:3, and The weight of the three components accounts for 55% of the total weight of the adhesive, and carbon nanotubes account for 40% of the total weight of the adhesive;
[0052] (3) Add
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