Water-based adhesive with high conductivity and preparation method of water-based adhesive with high conductivity

An adhesive and high-conductivity technology, applied in the direction of conductive adhesives, non-polymer adhesive additives, monocarboxylate copolymer adhesives, etc., can solve low adhesive strength, yellowing by high temperature, Complicated and cumbersome process steps and other issues, to achieve the effect of good stability and wide application

Inactive Publication Date: 2017-01-04
FOSHAN CITY YONGHENGDA NEW MATERIAL TECH CO LTD
View PDF1 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, water-based adhesives in the domestic market, such as water-based adhesives such as vinyl acetate homopolymer emulsions and acrylate copolymer emulsions, cannot be used in the market well due to the shortcomings of low adhesive strength and yellowing at high temperatures. is applied, and the polymer itself has certain insulating properties, but when the adhesive is required to conduct electricity, the more expensive conductive adhesive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:

[0031] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 75°C;

[0032] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Silicone monomer parts, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate were added to the reactor and mixed evenly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water was 0.3:1:2, and The weight of the three components accounts for 55% of the total weight of the adhesive, and carbon nanotubes account for 40% of the total weight of the adhesive;

[0033]

Embodiment 2

[0038] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:

[0039] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 85°C;

[0040] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Silicon monomer, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate were added into the reactor and mixed uniformly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water was 0.7:1:3, and The weight of the three components accounts for 75% of the total weight of the adhesive, and carbon nanotubes account for 20% of the total weight of the adhesive;

[0041] (

Embodiment 3

[0049] Described a kind of water base binder with high electrical conductivity, it is prepared by following method:

[0050] (1) Add deionized water and polyvinyl alcohol into the reactor, stir and heat up to 95°C, and after the polyvinyl alcohol is completely dissolved, cool down to 75°C;

[0051] (2) The carbon nanotubes were condensed and refluxed in concentrated nitric acid at 180°C for 12 hours, filtered and washed, and the reaction monomers vinyl acetate, ethylene-vinyl acetate resin, treated carbon nanotubes, organic compounds containing unsaturated double bonds Add silicon monomer parts, polyvinyl alcohol, butyl acrylate, and vinyl tertiary carbonate into the reactor and mix evenly, wherein the mass ratio of vinyl acetate resin, ethylene-vinyl acetate resin, and deionized water is 0.3:1:3, and The weight of the three components accounts for 55% of the total weight of the adhesive, and carbon nanotubes account for 40% of the total weight of the adhesive;

[0052] (3) Add

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a water-based adhesive with high conductivity. The water-based adhesive is prepared from the following raw materials: vinyl acetate resin, ethylene-vinyl acetate resin, deionized water, an organosilicone monomer containing unsaturated double bonds, polyvinyl alcohol, butyl acrylate, vinyl versatate and a silane coupling agent, wherein the weights of three components, namely the vinyl acetate resin, the ethylene-vinyl acetate resin and the deionized water account for 55 to 75 percent of total weight of the adhesive; in addition, the mass ratio of the vinyl acetate resin to the ethylene-vinyl acetate resin to the deionized water is (0.3 to 0.7) to 1 to (2 to 3); a carbon nanotube accounts for 20 to 40 percent of total weight of the adhesive; the stability of the adhesive is good; the storage period at the temperature of 5DEG C below zero to 50DEG C is greater than or equal to 12 months; the water-based adhesive has the advantages of no toxicity, no odor, no pollution, no corrosion, no combustion, coating without wire drawing and the like; bonding firmness, high-temperature stability, high mechanical strength, toughness and ultraviolet radiation resistance of a solar cell composite back plate can be improved.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Owner FOSHAN CITY YONGHENGDA NEW MATERIAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products