Diamond micro-channel Cu-based CVD diamond heat sink sheet and preparation method thereof
一种金刚石、微通道的技术,应用在通过传导传热进行修饰、冷却/通风/加热改造等方向,能够解决热膨胀系数大、损坏电子元器件等问题,达到散热性能优、容易剥离、提高形核密度和生长速率的效果
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[0065] A kind of preparation method of diamond microchannel Cu base CVD diamond heat sink of the present invention comprises the following steps:
[0066] S1. Wire cutting the oxygen-free copper substrate with a purity of 99.99% to 99.999% and a diameter of 10 to 20 mm into copper sheets of 0.5 to 1 mm as a Cu substrate, and cleaning the surface of the Cu substrate;
[0067] S2. Fabrication of the micro-via template, the micro-via template adopts oxygen-free copper with the same specifications as the Cu substrate;
[0068] S201, Cu substrate stamping and drilling, the micro-via manufacturing process includes mechanical stamping and drilling, hydraulic drilling, laser drilling, drilling, etc.; the micro-via template is composed of a micro-via array, and the diameter of the micro-via is 0.3 ~0.5mm, channel spacing 2~3mm; micro-via shapes include circle, regular triangle, square, regular hexagon or regular octagon, etc., such as Figure 5 shown;
[0069] S202. Use a hydrochlori...
Embodiment 1
[0092] S1, cutting the oxygen-free copper substrate with a purity of 99.99% and a diameter of 10mm into 0.5mm copper sheets as the Cu substrate, and cleaning the surface of the Cu substrate;
[0093] S201, Cu substrate stamping and drilling, the micro-via manufacturing process includes mechanical stamping and drilling, hydraulic drilling, laser drilling, drilling, etc.; the micro-via template is composed of a micro-via array, and the diameter of the micro-via is 0.3 mm, the channel spacing is 2mm; the shape of micro-vias includes circle, regular triangle, square, regular hexagon or regular octagon;
[0094] S202, use a hydrochloric acid solution with a volume ratio of 0.5% to slightly corrode the Cu substrate and the micro-via template for 3 minutes, and remove the oxide film and processing burrs in the micro-via;
[0095] S203, using acetone, alcohol, and deionized water to ultrasonically clean the substrate and the micro-via template for 3 minutes, remove organic matter on t...
Embodiment 2
[0113] S1. Wire cutting the oxygen-free copper substrate with a purity of 99.99% and a diameter of 14mm into 0.7mm copper sheets as a Cu substrate, and cleaning the surface of the Cu substrate;
[0114] S201, Cu substrate stamping and drilling, the micro-via manufacturing process includes mechanical stamping and drilling, hydraulic drilling, laser drilling, drilling, etc.; the micro-via template is composed of a micro-via array, and the diameter of the micro-via is 0.4 mm, the channel spacing is 2mm; the shape of micro-vias includes circle, regular triangle, square, regular hexagon or regular octagon;
[0115] S202, use a hydrochloric acid solution with a volume ratio of 0.5% to slightly corrode the Cu substrate and the micro-via template for 4 minutes, and remove the oxide film and processing burrs in the micro-via;
[0116] S203, sequentially use acetone, alcohol, and deionized water to ultrasonically clean the substrate and the micro-via template for 4 minutes, remove organ...
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