Miniature microphone and manufacturing method of miniature microphone

一种制造方法、麦克风的技术，应用在MEMS领域，能够解决减小寄生电容、器件性能不利影响等问题

Inactive Publication Date: 2020-10-13
HANGZHOU SILAN MULTICHIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above problems, the object of the present invention is to provide a micro-microphone and a method of manufacturing the micro-microphone, which reduces the parasitic capacitance and solves the problem that the process deviation of deep groove etching and corrosion sacrificial layer has an adverse effect on device performance

Method used

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Embodiment Construction

[0061] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

[0062] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0063] Microphones are acoustic-electric transducers based on MEMS technology. In recent years, the manufacturing process of miniature microphones has developed rapidly, and has been widely used in consumer electronics products such as TWS earphones, smart phones, smart speakers, and notebook computers. Miniature microphones mainly include: MEMS chips and IC chips. The MEMS chip is a vibration detection device, which is used to convert the external sound signal into an electrical signal, and the...

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Abstract

The invention discloses a miniature microphone and a manufacturing method of the miniature microphone. The miniature microphone comprises a substrate which comprises a first cavity; a first sacrificial layer which is located on the substrate, wherein the first sacrificial layer comprises a second cavity; a vibrating diaphragm layer of which at least one part is supported by the first sacrificial layer, wherein the vibrating diaphragm layer located above the second cavity forms a vibrating diaphragm; a second sacrificial layer which is located on the vibrating diaphragm layer, wherein the second sacrificial layer comprises a third cavity; a back polar plate layer which is located on the second sacrificial layer of which at least one part is supported by the second sacrificial layer, whereinthe back polar plate layer located above the third cavity forms a back polar plate, and the back polar plate comprises at least one sound hole; a first passivation layer which is located between thevibrating diaphragm layer and the back polar plate layer, wherein the first passivation layer surrounds the inner side wall of the second sacrificial layer. According to the miniature microphone provided by the embodiment of the invention, the parasitic capacitance is reduced, and the problem of adverse influence of process deviation on the device performance is solved.

Description

technical field [0001] The invention relates to the technical field of MEMS, in particular to a miniature microphone and a manufacturing method of the miniature microphone. Background technique [0002] With the development of micro-machining technology, miniature microphones are becoming more and more miniaturized, wherein, for example, the distance between the diaphragm and the back plate of the micro-microphone is less than 1.5um, and the technological requirements in the manufacture and application of the micro-microphone are also getting higher and higher. come higher. The structural defects introduced by the process deviation not only affect the product yield of the microphone, but also lead to a sharp deterioration of the performance of the miniature microphone in the application environment. In addition, the capacitance change caused by the vibration of the diaphragm due to the air vibration generated by the sound signal of the miniature microphone includes not only...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/00H04R19/04H04R31/00
CPCH04R19/005H04R19/04H04R31/00H04R2201/003H04R2231/00H04R2410/00
Inventor 孙福河李佳许乐军金文超闻永祥
Owner HANGZHOU SILAN MULTICHIP CO LTD
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