Preparation method of glass substrate

[0019] A method for making a glass substrate, a first aspect of the embodiment of the present application, the process comprising the steps of:

[0020] S01: providing an initial glass substrate;

[0021] S02: Preparation of the conductive pattern on a surface of the starting glass substrate;

[0022] S03: In the back side aluminum paste formed initially coated glass substrate having a conductive pattern, is dried, and then co-sintered to obtain a glass substrate.

[0023] The method of preparing a glass substrate according to an embodiment of the present application, a method for producing a glass substrate circuit board, the production method of the thermal conductivity of the glass substrate obtained is significantly improved, can solve the problem of heat dissipation of the glass substrate; in particular, the initial glass substrate having two opposing surfaces, the aluminum paste prepared in Example a conductive pattern of the surface of the starting substrate, i.e., the other s

[0036] Example 1

[0037] A method of preparing a glass substrate copper circuit board, comprising the steps of:

[0038] 1, taken respectively, said copper powder 81g 0.3-0.5μm, the glass frit 9g, diethylene glycol monobutyl ether 6g, dodecanol fat 2g, ethyl cellulose 0.5g, dispersants 0.9g, 0.6g thixotropic agent added to the vessel, the pre-mixed with stirring, and then dispersed with a three roll mill to obtain a fineness blade <5μm of electroconductive copper paste;

[0039] 2, the aluminum powder were weighed 71.25g 2μm ~ 1, and 3.75 g of glass frit, diethylene glycol monobutyl ether 16g, dodecanol fat 4.3g, 3.75 g of ethyl cellulose, a dispersant 0.75g, thixotropic agents 0.2g added to the vessel, stirred pre-mix, and then using a three roll mill dispersion, to give the blade a fineness <5μm of high thermal conductivity aluminum paste;

[0040] 3, the above prepared electroconductive copper paste by screen printing on the corresponding pattern of 2mm ordinary glass, printed wi

[0045] Example 2

[0046] A method of preparing a glass substrate copper circuit board, comprising the steps of:

[0047] 1, taken respectively, said copper powder 81g 0.3-0.5μm, the glass frit 9g, diethylene glycol monobutyl ether 6g, dodecanol fat 2g, ethyl cellulose 0.5g, dispersants 0.9g, 0.6g thixotropic agent added to the vessel, the pre-mixed with stirring, and then dispersed with a three roll mill to obtain a fineness blade <5μm of electroconductive copper paste;

[0048] 2, the aluminum powder were weighed 80.75g 2μm ~ 1, and 4.25 g of glass frit, diethylene glycol monobutyl ether 8g, dodecanol 4.65 g of fat, ethyl cellulose 1.2g, 0.85 g dispersant, a thixotropic agent 0.3g added to the vessel, stirred pre-mix, and then using a three roll mill dispersion, to give the blade a fineness <5μm of high thermal conductivity aluminum paste;

[0049] 3, the above prepared electroconductive copper paste by screen printing on the corresponding pattern of 2mm ordinary glass, printed wit