Backlight module, preparation method thereof and display device

A technology for backlight modules and encapsulation adhesives, applied in optics, nonlinear optics, instruments, etc., can solve the problems of large gap between two substrates and optical crosstalk, and achieve the effect of reducing distance, eliminating gap and reducing optical crosstalk.

Pending Publication Date: 2022-05-17
广州华星光电半导体显示技术有限公司
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Problems solved by technology

[0004] Embodiments of the present application provide a backlight module, its manufacturing method, and a display device, so

Method used

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  • Backlight module, preparation method thereof and display device
  • Backlight module, preparation method thereof and display device
  • Backlight module, preparation method thereof and display device

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Embodiment Construction

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0048] In order to solve the existing problem that the gap between two substrates is usually large and optical crosstalk is likely to occur, embodiments of the present application provide a backlight module, a manufacturing method thereof, and a display device, which will be described below with reference to the accompanying drawings.

[0049] Exemplary, see figure 1 , figure 1 A schematic structural diagram of a display device provided in an embodiment of the present application.

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Abstract

The embodiment of the invention provides a backlight module, a preparation method of the backlight module and a display device, and the backlight module comprises a plurality of mini-LED chips which are arranged at intervals; the packaging adhesive layer is arranged on all the mini-LED chips, and the space between every two adjacent mini-LED chips is filled with the packaging adhesive layer; the light absorption layer is arranged on the side, away from the mini-LED chips, of the packaging adhesive layer, a plurality of through holes are formed in the light absorption layer, and the through holes correspond to the mini-LED chips one to one; and the quantum dots are arranged in at least one through hole. The quantum dots are arranged on the side, deviating from the mini-LED chip, of the packaging adhesive layer, the scheme that the quantum dots are arranged on the color film substrate and then attached to the array substrate in a paired mode is replaced, the gap between the two substrates can be eliminated, the distance between the quantum dots and the mini-LED chip is reduced, and the yield of the LED is improved. And the problem of light crosstalk caused by a large gap between the two substrates between the adjacent mini-LED chips is further reduced.

Description

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Claims

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Application Information

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Owner 广州华星光电半导体显示技术有限公司
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