Semiconductor device and manufacturing method thereof

[0026] The following is an explanation of related embodiments of a semiconductor device and its manufacturing method proposed according to the present invention. FIG. 1 is a schematic diagram illustrating a first embodiment. Just as shown in the schematic plan view in FIG. 1(a), the semiconductor device of the first embodiment has an LOC structure, and is provided with an on-chip semiconductor element 1, and a plurality of pins L and common lines 2a and 2b pass through the semiconductor element 1. The insulating tape T on the substrate 1a is connected to provide electrical connections for the electrode pads that handle common signals among the many electrode pads on the substrate 1a, and the bonding wire W that electrically connects the electrode pads to the pin L.

[0027] In this semiconductor device, the common line 2a constitutes a power line by being electrically connected to the electrode pad P1 connected to the power supply, and the common line 2b constitutes a ground wire