Power module package and method for manufacturing the same

Inactive Publication Date: 2013-01-10
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009]The present invention has been made in an effort to provide a power module package for improving heat radiation efficiency by formi

Problems solved by technology

However, in the case of the above-mentioned structure, a manufacturing cost for each of the power module and the water cooling system increa

Method used

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  • Power module package and method for manufacturing the same
  • Power module package and method for manufacturing the same
  • Power module package and method for manufacturing the same

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Embodiment Construction

[0035]Various features and advantages of the present invention will be more obvious from the following description with reference to the accompanying drawings.

[0036]The terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe most appropriately the best method he or she knows for carrying out the invention.

[0037]The above and other objects, features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. In the specification, in adding reference numerals to components throughout the drawings, it is to be noted that like reference numerals designate like components e

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Abstract

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

Description

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Claims

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Application Information

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Owner SAMSUNG ELECTRO MECHANICS CO LTD
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