The invention discloses a novel
metal compounding process. The process comprises the following steps of: (1) performing
surface roughening treatment to ensure that the surfaces of bonding
layers are dissolved and roughened; (2) preparing a complex, namely adding an interlayer
metal material with
low melting point and high electric
conductivity between substrate-layer
metal and composite-layer metal so as to ensure that the interlayer metal material is permeated between the substrate-layer metal and the composite-layer metal to form metallurgical bonding; and (3) rolling the complex on a
roller mill so as to closely bond the substrate-layer metal and the composite-layer metal. According to the process, an
explosive cladding link is eliminated in a production environment, so that the harm of
explosive cladding to the environment is reduced; the production cost is saved, and the
production cycle is shortened; and moreover, the
welding and rolling of all bonding surfaces are combined, so that the bonding compactness is relatively high.