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6 results about "Low melting point" patented technology

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A low melting point means it's more likely that at the current temperature that the substance is a liquid. So, something like #Br_2(l)# has a low melting point (#-7.2^oC#). A low melting point also means that the inter-molecular forces that cause attractions between one molecule and another are not very strong.

Solar cell and method of manufacture thereof, and solar cell module

ActiveUS20130312827A1Lower resistanceImprove efficiencyFinal product manufactureSemiconductor/solid-state device manufacturingPhotoelectric conversionSolar cell

Disclosed is a solar cell having a collecting electrode on one main surface of a photoelectric conversion section. The collecting electrode includes a first electroconductive layer and a second electroconductive layer in this order from the photoelectric conversion section side, and further includes an insulating layer between the first electroconductive layer and the second electroconductive layer. The first electroconductive layer includes a low-melting-point material, and a part of the second electroconductive layer is conductively connected with the first electroconductive layer through, for example, an opening in the insulating layer. The second electrode layer is preferably formed by a plating method. In addition, it is preferable that before forming the second electroconductive layer, annealing by heating is carried out to generate the opening section in the insulating layer.

Owner:KANEKA CORP

Group III-V semiconductor device and method for producing the same

InactiveUS20080149953A1Avoid crackingSemiconductor/solid-state device manufacturingSemiconductor devicesSemiconductorMetal

The method of the invention for producing a group III-V semiconductor device includes forming, on a base, a plurality of semiconductor devices isolated from one another, each semiconductor device having at least an n-layer proximal to the base, and a p-layer distal to the base, and having a p-electrode formed on the top surface of the p-layer, and a first low-melting-point metal diffusion preventing layer, the low-melting-point metal diffusion preventing layer being formed on the top surface of the p-electrode; forming, from a dielectric material, a side-surface protective film so as to cover a side surface of each semiconductor device; bonding the semiconductor device to a conductive support substrate via a low-melting-point metal layer; and removing the base through the laser lift-off process.

Owner:TOYODA GOSEI CO LTD

High-temperature-resistant powder paint and preparation method thereof

InactiveCN105860765ALow curing temperatureShort curing timeFireproof paintsPowdery paintsPolyester resinTemperature resistance

The invention provides a high-temperature-resistant powder paint. The high-temperature-resistant powder paint is prepared from, by weight, 60-70 parts of epoxy resin, 8-10 parts of polyester resin, 10-15 parts of organosilicon resin, 3-4 parts of dicyandiamide, 4-6 parts of pearl powder, 4-6 parts of low-melting-point glass micropowder, 1-2 parts of polyvinyl butyral, 0.2-0.4 part of sebacic dihydrazide, 1-2 parts of a titanate coupling agent, 10-15 parts of titanium dioxide, 6-8 parts of cordierite powder, 1-2 parts of 2,6-tert-butyl-4-methylphenol, 8-10 parts of core-shell polysiloxane particles and 1-3 parts of a modification agent. The paint is low in curing temperature and short in curing time, and a paint film is good in leveling property, strong in adhesion, good in appearance, resistant to acid and alkali resistance and good in high-temperature resistance.

High-temperature-resistant powder paint and preparation method thereof

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Owner:合肥燕美新材料科技有限公司

Novel metal compounding process

InactiveCN105313422AHarm reductionHigh strengthLaminationLamination apparatusExplosive claddingMetallic materials

The invention discloses a novel metal compounding process. The process comprises the following steps of: (1) performing surface roughening treatment to ensure that the surfaces of bonding layers are dissolved and roughened; (2) preparing a complex, namely adding an interlayer metal material with low melting point and high electric conductivity between substrate-layer metal and composite-layer metal so as to ensure that the interlayer metal material is permeated between the substrate-layer metal and the composite-layer metal to form metallurgical bonding; and (3) rolling the complex on a roller mill so as to closely bond the substrate-layer metal and the composite-layer metal. According to the process, an explosive cladding link is eliminated in a production environment, so that the harm of explosive cladding to the environment is reduced; the production cost is saved, and the production cycle is shortened; and moreover, the welding and rolling of all bonding surfaces are combined, so that the bonding compactness is relatively high.

Owner:匡永刚

Wide-temperature quick-response negative liquid crystal composition and application thereof

InactiveCN113621385AHD highlightsLow melting pointLiquid crystal compositionsNon-linear opticsCrystallographyIn vehicle

The invention relates to a wide-temperature quick-response negative liquid crystal composition and application thereof, belonging to the technical field of liquid crystal materials. The negative liquid crystal composition comprises, by mass, 1-30% of a monomeric compound having a structure represented by a general formula I, 0.5-75% of a monomeric compound with a structure as shown in a general formula II, 0.5-88% of a monomeric compound with a structure as shown in a general formula III and 2%-30% of a monomeric compound as shown in a general formula IV. The wide-temperature quick-response negative nematic liquid crystal composition has a high clearing point, a low melting point, a wide phase temperature range and quick response time, the response speed of a vehicle-mounted liquid crystal is increased, and the problems of smear and unsmoothness of a display picture caused by slow response time of the vehicle-mounted liquid crystal are solved.

Owner:CHONGQING HANLANG JINGGONG TECH CO LTD

Heat-insulating glass glaze and preparation method thereof

InactiveCN112830680ALower glass transition temperatureHigh visible light transmittanceVitrificationThermal radiation

The invention discloses a heat-insulating glass glaze and a preparation method thereof, and the preparation method of the heat-insulating glass glaze comprises the step of uniformly mixing low-melting-point glass powder, a heat radiation blocking agent, sodium silicate and a heat conduction blocking agent to obtain the heat-insulating glass glaze. The preparation method of the low-melting-point glass powder comprises the following steps: uniformly mixing raw materials, melting at 500-700 DEG C for 10-50 minutes to obtain molten glass, and quenching the molten glass to obtain bulk glass; and crushing the bulk glass, and performing ball milling in a ball mill to obtain the low-melting-point glass powder. The components of the low-melting-point glass powder are adjusted, and a small amount of Li2O, ZrO2, Na2O and NaF are introduced into the low-melting-point glass powder, so that the glass-transition temperature of the low-melting-point glass powder can be reduced to be less than or equal to 300 DEG C, and the visible light transmittance of the transparent heat-insulating coating can be improved to be greater than or equal to 90%.

Owner:NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY